Patents by Inventor Christopher A. Bang

Christopher A. Bang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190227099
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Applicant: Microfabrica Inc.
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Publication number: 20190221911
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: October 22, 2018
    Publication date: July 18, 2019
    Applicant: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Publication number: 20180241112
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: February 2, 2018
    Publication date: August 23, 2018
    Applicant: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Publication number: 20170263994
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: December 21, 2016
    Publication date: September 14, 2017
    Applicant: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Patent number: 9620834
    Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: April 11, 2017
    Assignee: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Patent number: 9614266
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 4, 2017
    Assignee: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Publication number: 20160109481
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
    Type: Application
    Filed: October 29, 2015
    Publication date: April 21, 2016
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Publication number: 20150311575
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: March 31, 2015
    Publication date: October 29, 2015
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Publication number: 20150108002
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: December 16, 2014
    Publication date: April 23, 2015
    Inventors: Kieun Kim, Adam L. Cohen, Willa M. Larsen, Richard Chen, Ananda H. Kumar, Ezekiel J.J. Kruglick, Vacit Arat, Gang Zhang, Michael S. Lockard, Christopher A. Bang, Jeffrey A. Thompson
  • Publication number: 20140231264
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
    Type: Application
    Filed: April 23, 2014
    Publication date: August 21, 2014
    Inventors: Richard T. Chen, Ezekiel J.J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Patent number: 8790460
    Abstract: Techniques are generally disclosed for forming crystalline bodies. An example system, device or method for forming crystalline bodies may include a crucible for containing molten crystalline material and a support for accommodating a seed on an end thereof, the support being movable along a translation axis in a pull direction to draw the seed crystal from the molten crystalline, thereby initiating growth of a crystalline body along a growth path. Further examples may include one or more nozzles configured to be coupled to a fluid source, the nozzles being positioned relative to the growth path for shaping the crystal body as the molten crystalline is pulled in the pull direction along the growth path.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: July 29, 2014
    Assignee: Empire Technology Development LLC
    Inventor: Christopher A Bang
  • Publication number: 20140197904
    Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g.
    Type: Application
    Filed: February 28, 2014
    Publication date: July 17, 2014
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Patent number: 8729916
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip and a compliant body wherein a portion of the complaint body is formed, then the contact tip is formed and then finally the rest of the compliant body is formed, wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: May 20, 2014
    Assignee: Microfabrica Inc.
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Patent number: 8723543
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip, a compliant body, and a bonding material that can be used in bonding the probe to a substrate and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: May 13, 2014
    Assignee: Microfabrica Inc.
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Patent number: 8717055
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein the probe structures include a contact tip and a compliant body with the compliant body formed from at least one material that is different from the tip material and wherein compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: May 6, 2014
    Assignee: Microfabrica Inc.
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Patent number: 8713788
    Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: May 6, 2014
    Assignee: Microfabrica Inc.
    Inventors: Elliot R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Patent number: 8717054
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods of forming probe structures include formation of a plurality of planar multi-material electrodeposited layers wherein each probe structure includes a contact tip and a compliant body, wherein the compliant body is formed from at least one material that is different from the contact tip material and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: May 6, 2014
    Assignee: Microfabrica Inc.
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Publication number: 20120061009
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
    Type: Application
    Filed: October 14, 2011
    Publication date: March 15, 2012
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Publication number: 20120062260
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
    Type: Application
    Filed: October 3, 2011
    Publication date: March 15, 2012
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
  • Publication number: 20120064227
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
    Type: Application
    Filed: October 14, 2011
    Publication date: March 15, 2012
    Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov