Abstract: A speaker mounting assembly adjustably supports a speaker from a mounting surface. The speaker mounting assembly comprises a speaker enclosure, a support arm, and a mounting bracket mounted to a mounting surface. The speaker enclosure defines a window opening, and the window opening is constructed to receive entry of an insert portion of the support arm. A latch supported by the enclosure and extending from the window opening can be used to engage with the insert portion to automatically retain the support arm when the insert portion is inserted into the window opening. A post extends within the enclosure window and the insert portion engages the post so as to enable pivoting of the speaker enclosure about the support arm. A set screw extends through a channel of the support arm toward the mounting bracket and based on position of the screw, permits pivoting of the support arm about the mounting bracket.

Abstract: An optical assembly includes a photodetector for detecting light signals. An optical fiber receives an input signal and has a light-emitting portion extending in front of the photodetector. A MEMS actuator is located between the light-emitting portion of the optical fiber and the photodetector. The MEMS actuator is controllably deflectable to partially obscure the photodetector and thereby vary the amount of light received.

Abstract: A fiber tail assembly (FTA) with a micro-lens formed in the fiber tip is used to couple the laser light out of the package and along the fiber. The FTA is soldered at two points where metallized bands are deposited on the fiber pigtail, one at a fiber mount near the diode where it can be soldered into alignment with the laser diode, and two at the snout which forms a feed through the housing and seal for the package. Typically, the FTA is metallized along its entire length within the package. In this invention the two-metallized bands are separated by a region that is unmetallized.

Abstract: The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.

Abstract: The present invention provides an indicator device, and a biological test method, for determining-the toxic fingerprint and degree of toxicity, comprising at least 3, preferably at least 11, different microorganisms freeze-dried on an inert support material, wherein the microorganisms are being selected to form a high diversity of microorganisms, on said support material, with regards to the taxonomical tree and high diversity regarding responses to toxic chemicals. Further, a kit and a process for producing the indicator device is also disclosed.

Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.

Abstract: The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.

Abstract: A method for forming a nozzle plate for an ink jet printer by laser ablation wherein topographical features are formed by laser ablation and additional ablation pulses are applied to remove debris from the nozzle plate.

Abstract: A method for forming a nozzle plate for an ink jet printer by laser ablation wherein topographical features are formed by laser ablation and additional ablation pulses are applied to remove debris from the nozzle plate.

Abstract: A pipe clamp for use in oil field operations is provided. The pipe clamp is particularly useful where pipe, casing or tubing must be grasped firmly. The pipe clamp is designed to be safer than existing technology by incorporating a lighter weight design that is self aligning and can be controlled from a relatively remote location. The pipe clamp is comprises a gripping head which wraps around the pipe, an actuator extending radially from the gripping head, and a chain wrapped around the gripping head and connected to a mount located at the radially distant end of the actuator. As the actuator extends, it increases the distance between the gripping head and the mount, thus the chain tightens the friction surfaces of the gripping head about the pipe.

Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.

Abstract: An ink jet cartridge assembly for use in an ink jet printer has a body with at least one inner ink chamber. A printhead is carried by the body and has a plurality of ink jetting orifices in fluid communication with the ink chamber. A tape automated bonding circuit carried by the body includes a flexible tape and a plurality of electrical traces. The flexible tape includes a chip window with a peripheral edge. The printhead is disposed within the chip window at a distance from the peripheral edge. Each electrical trace has a bottom side adjacent the body, a substrate held portion carried by the flexible tape, a free trace portion extending between the peripheral edge of the chip window and the printhead, and a printhead held portion connected with the printhead. The tape automated bonding circuit further includes a photoimagable coating which covers the bottom side of each electrical trace on all of the substrate held portion and the free trace portion, but does not cover the printhead held portion.

Abstract: A pipe handling system comprises a rig floor supported frame adapted to be positioned above the rotary table and in alignment with the hole in the rotary table. It incorporates a centrally located bowl lined with the frame to enable a string of pipe to extend through the rotary table. Appropriate releasable slips are moved into and out engagement. The frame supports an overhead mounting plate, and one version thereof it incorporates hydraulic jacks to raise and lower the mounting plate. The mounting plate supports a horizontally directed hydraulic ram which moves the two end lengths of a long multi length chain looped into a bight to go around a pipe passing near the end of the mounting plate. The bight in the chain grips the coupling of the pipe to hold it fast. This mechanism cooperated with an overhead power tong assembly to enable threading or unthreading of pipe casing and tubing.

Abstract: Apparatus and methods for aligning a powder spray canopy of a powder coating booth with a fan plenum assembly so that a powder collector can be quickly aligned and simultaneously sealed to both the powder spray canopy and the fan plenum. The invention also relates to an improved filter cartridge and filter cartridge mounting assembly which allows for quick and easy mounting and dismounting of filter cartridges to the powder collector.