Patents by Inventor Christopher A. Hunrath

Christopher A. Hunrath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structures for z-axis interconnection of multilayer electronic substrates
    Patent number: 9545017
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: January 10, 2017
    Assignees: Ormet Circuits, Inc., Integral Technology, Inc.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
  • STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES
    Publication number: 20140231126
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicants: INTEGRAL TECHNOLOGY, INC., ORMET CIRCUITS, INC.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
  • FLEXIBLE BENZOXAZINE RESIN
    Publication number: 20130317155
    Abstract: One or more embodiments contained herein disclose an adhesive for printed circuit board (PCB) applications. The improved adhesive may comprise a benzoxazine resin and a polyester plasticizer.
    Type: Application
    Filed: May 21, 2013
    Publication date: November 28, 2013
    Applicant: Integral Technology, Inc.
    Inventors: Christopher A. Hunrath, Khang Tran
  • MULTIPLE LAYER Z-AXIS INTERCONNECT APPARATUS AND METHOD OF USE
    Publication number: 20130062099
    Abstract: A multiple layered apparatus and method for forming a z-axis interconnect is provided. The multiple layered apparatus comprises a protective layer, a dielectric layer, a conductive layer, and a support layer. A method for forming a z-axis interconnect using the multiple layer apparatus resulting in a thinner and less expensive structure for printed circuit board applications.
    Type: Application
    Filed: August 9, 2012
    Publication date: March 14, 2013
    Applicant: CAC, INC.
    Inventor: Christopher A. Hunrath
  • INSULATING LAYER FOR RIGID PRINTED CIRCUIT BOARDS
    Publication number: 20120227258
    Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
    Type: Application
    Filed: May 22, 2012
    Publication date: September 13, 2012
    Applicant: INTEGRAL TECHNOLOGY, INC.
    Inventor: Christopher A. Hunrath
  • ADHESIVE FILM LAYER FOR PRINTED CIRCUIT BOARD APPLICATIONS
    Publication number: 20120141753
    Abstract: One or more embodiments contained herein disclose an adhesive layer for printed circuit board (PCB) applications. The improved adhesive film layer may comprise a benzoxazine resin and a phenoxy resin. According to some embodiments, the improved adhesive film layer may be coated onto a polyester release sheet.
    Type: Application
    Filed: December 1, 2011
    Publication date: June 7, 2012
    Inventor: Christopher A. Hunrath
  • Insulating layer for rigid printed circuit boards
    Patent number: 8188373
    Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: May 29, 2012
    Assignee: Integral Technology, Inc.
    Inventor: Christopher A. Hunrath
  • INSULATING LAYER FOR RIGID PRINTED CIRCUIT BOARDS
    Publication number: 20090151989
    Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 18, 2009
    Inventor: Christopher A. Hunrath