Patents by Inventor Christopher A. Lopez
Christopher A. Lopez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10126359Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.Type: GrantFiled: January 12, 2017Date of Patent: November 13, 2018Assignee: Sensata TechnologiesInventors: Thomas F. Lemczyk, David L. Weston, Christopher A. Lopez, Richard A. Davis
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Publication number: 20180196102Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.Type: ApplicationFiled: January 12, 2017Publication date: July 12, 2018Applicant: SENSATA TECHNOLOGIESInventors: Thomas F. Lemczyk, David L. Weston, Christopher A. Lopez, Richard A. Davis
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Patent number: 9921265Abstract: Featured are devices, systems and methods for testing an electronic device, such as an integrated chip. Such a testing method includes disposing a thermal clutch between a variable heat sink that absorbs heat energy and a heat source member that selectively delivers heat energy. When the thermal clutch is operated in a first manner the thermal clutch thermally couples the variable heat sink to the electronic device under test (DUT) and when operated in the second manner, the thermal clutch thermally de-couples the variable heat sink from the DUT. Also, when the thermal clutch is operated in the second manner, the heat source member is thermally coupled to the DUT and is operated so as to produce heat energy which is thus provided to the thermally coupled DUT.Type: GrantFiled: December 18, 2015Date of Patent: March 20, 2018Assignee: Sensata Technologies, Inc.Inventors: Christopher A. Lopez, Rick A. Davis
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Patent number: 9709622Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.Type: GrantFiled: March 13, 2014Date of Patent: July 18, 2017Assignee: Sensata Technologies, Inc.Inventors: Christopher A. Lopez, Thomas F. Lemczyk, Rick A. Davis
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Publication number: 20170176515Abstract: Featured are devices, systems and methods for testing an electronic device, such as an integrated chip. Such a testing method includes disposing a thermal clutch between a variable heat sink that absorbs heat energy and a heat source member that selectively delivers heat energy. When the thermal clutch is operated in a first manner the thermal clutch thermally couples the variable heat sink to the electronic device under test (DUT) and when operated in the second manner, the thermal clutch thermally de-couples the variable heat sink from the DUT. Also, when the thermal clutch is operated in the second manner, the heat source member is thermally coupled to the DUT and is operated so as to produce heat energy which is thus provided to the thermally coupled DUT.Type: ApplicationFiled: December 18, 2015Publication date: June 22, 2017Inventors: Christopher A. Lopez, Rick A. Davis
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Publication number: 20140260333Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Inventors: Christopher A. Lopez, Thomas F. Lemczyk, Rick A. Davis
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Patent number: 7482825Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.Type: GrantFiled: October 30, 2007Date of Patent: January 27, 2009Assignee: Wells-CTI, LLCInventors: Christopher A. Lopez, Brian J. Denheyer, Gordon B. Kuenster
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Publication number: 20080238466Abstract: An apparatus is provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.Type: ApplicationFiled: June 10, 2008Publication date: October 2, 2008Applicant: WELLS-CTI, LLCInventors: Christopher A. Lopez, Brian J. Denheyer
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Patent number: 7394271Abstract: An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.Type: GrantFiled: March 3, 2006Date of Patent: July 1, 2008Assignee: Wells-CTI, LLCInventors: Christopher A. Lopez, Brian J. Denheyer
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Patent number: 7312620Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.Type: GrantFiled: November 21, 2006Date of Patent: December 25, 2007Assignee: Wells-CTI, LLCInventors: Christopher A. Lopez, Brian J. Denheyer, Gordon B. Kuenster
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Patent number: 7187189Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.Type: GrantFiled: March 3, 2006Date of Patent: March 6, 2007Assignee: Wells CTI-LLCInventors: Christopher A. Lopez, Brian J. Denheyer, Gordon B. Kuenster
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Patent number: 7123037Abstract: An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC.Type: GrantFiled: August 17, 2004Date of Patent: October 17, 2006Assignee: WELLS-CTI, LLCInventor: Christopher A. Lopez
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Patent number: 7042240Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.Type: GrantFiled: February 28, 2005Date of Patent: May 9, 2006Assignee: Wells-CTI, LLCInventors: Christopher A. Lopez, Brian J. Denheyer, Gordon B. Kuenster
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Publication number: 20020150375Abstract: A method and apparatus for sealing an optical fiber in the wall of a modulator housing utilizes a metal crimp to compress sealingly a elastomer sleeve against the optical fiber.Type: ApplicationFiled: April 13, 2001Publication date: October 17, 2002Inventors: Henry H. Hung, Christopher A. Lopez, Majid Malakia