Abstract: The present invention provides compounds of formula (I); pharmaceutically acceptable salts and N-oxides thereof in which A, B, D and E are C or N with the proviso that one or more are N, R1, R2, R3, R4, R5 and R6 are simple substituents, n is 0-3 and y is an aryl, heteroaryl, carbocyclyl or fused-carbocyclyl group; as VR-1 antagonists for treating conditions or diseases in which pain and/or inflammation predominates; the use of the same for manufacturing medicaments, pharmaceutical compositions comprising them and methods of treatment utilising them.

Abstract: The present invention is directed to compounds of the formula I: (wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, X, n and the dashed line are defined herein) which are useful as modulators of chemokine receptor activity. In particular, these compounds are useful as modulators of the chemokine receptor CCR-2. The present invention is also directed to intermediates useful in the preparation of formula I compounds.

Abstract: The present invention is directed to compounds of the formula I: (wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, X, n and the dashed line are defined herein) which are useful as modulators of chemokine receptor activity. In particular, these compounds are useful as modulators of the chemokine receptor CCR-2.

Abstract: The present invention is directed to compounds of the formula I: 1

Abstract: A technique for providing an elastic RF interconnection between first and second planar conductors, which provides stress relief against mechanical and environment stresses. A length of a compressible wire bundle having first and second end portions is used as the elastic conductor. The first end portion is attached to an end of the first conductor. The second end portion is attached to an end of the second conductor. In a typical application, the first and second conductors are disposed on separate substrates, in turn mounted to a package surface.

Abstract: Flip chip monolithic microwave integrated circuits (MMIC) devices formed on gallium arsenide substrates and use thermally bumped diodes and field effect transistor devices to achieve improved heat dissipation and power protection. Flip chip limiter MMIC devices and transmit/receive switch MMIC devices are specifically provided by the present invention. The flip chip gallium arsenide limiter and transmit/receive switch MMIC devices use plated metallized bumps for both I/O connections and for thermal connections to a host substrate (aluminum nitride). The present invention also incorporates coplanar waveguide transmission line, thereby eliminating backside processing of the gallium arsenide substrates. The transmit/receive switch device provides power protection in both transmit and receive modes.

Abstract: A space-saving, two-sided microwave transmission line for hybrid circuits is disclosed, wherein a microstrip or coplanar waveguide RF line is formed on the front side and a microstrip or coplanar waveguid RF transmission line is formed on the backside of a hybrid circuit board containing other components. The RF line is formed on the top side of the circuit board to facilitate connections to other circuit boards and/or RF components, but is routed underneath the board to traverse the areas of the board occupied by other components. When the RF line is on the top side of the substrate, the groundplane is established by the metal layer on the bottom of the substrate for a microstrip line and by a top metal layer for a coplanar waveguide line, and when the RF line is on the bottom of the substrate, the groundplane is established with the metal layer on top of the substrate for a microstrip line, and with the bottom metal layer for a coplanar waveguide line.