Abstract: A semi-conductive, static-dissipative polymeric composite comprising an insulative polymeric resin, and from about 5 to about 60 volume percent of a particulate filler having thin-film, inorganic coatings of semi-conducting material, such composites having volume resistivities of from about 1.times.10.sup.4 --to about 1.times.10.sup.14 ohm-cm. In preferred semi-conductive, static-dissipative polymeric composites, the particulate filler has a thin-film coating of a semi-conducting material selected from the group consisting of transition metal oxides, carbides and nitrides.

Abstract: A test socket for testing chips and chips on tape wherein the test socket is formed on a heat resistant dielectric film having contact pads and connector pads joined by metallic circuit traces and which film is wrapped on a compliant pad. The connector end of the tape is joined to a circuit board by a conductive tape and maintained in contact by the compliant pad. A frame registers the chip with the contact area of the tape.