Abstract: A heat sink and method of making the same. The heat sink includes a plurality of substantially planar fins, each of substantially uniform thickness, which are stacked together in alternating relation to one another. Each fin includes a base portion, a top portion, a fin side and a base side, with the base side of each fin being joined to the base side of adjacent fins to form a substantially planar surface. The base side of each fin is dimensioned to form a space between the top portions of adjoining fins, the space being of a dimension that is substantially equal to the thickness of the fin. The method includes the steps of forming a plurality of substantially planar fins of a substantially uniform thickness, stacking the fins together in alternating relation to one another, and joining the stacked fins together to form the heat sink.

Abstract: A heat sink and method of making the same. The heat sink includes a plurality of substantially planar fins, each of substantially uniform thickness, which are stacked together in alternating relation to one another. Each fin includes a base portion, a top portion, a fin side and a base side, with the base side of each fin being joined to the base side of adjacent fins to form a substantially planar surface. The base side of each fin is dimensioned to form a space between the top portions of adjoining fins, the space being of a dimension that is substantially equal to the thickness of the fin. The method includes the steps of forming a plurality of substantially planar fins of a substantially uniform thickness, stacking the fins together in alternating relation to one another, and joining the stacked fins together to form the heat sink.

Abstract: A device for attaching a heat sink to an electronic package comprises a pin having a compressible point, the point being adapted to pass through aligned holes in a heat sink and a printed circuit board so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package therebetween.