Patents by Inventor Christopher Alan PEURA

Christopher Alan PEURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power grid and standard cell co-design structure and methods thereof
    Patent number: 10748889
    Abstract: According to one general aspect, an apparatus may include a metal layer having a metal pitch between metal elements, and a gate electrode layer having a gate pitch between gate electrode elements, wherein the gate electrode pitch is a ratio of the metal pitch. The apparatus may include at least two power rails coupled, by via staples, with the metal layer, wherein the via staples at least partially overlap one or more of the gate electrode elements. The apparatus may include even and odd pluralities of standard cells, each respectively located in even/odd placement sites wherein portions of the standard cells that carry signals within the metal layer do not connect to the via staples.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: August 18, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Matthew Berzins, Andrew Paul Hoover, Christopher Alan Peura
  • POWER GRID AND STANDARD CELL CO-DESIGN STRUCTURE AND METHODS THEREOF
    Publication number: 20190385999
    Abstract: According to one general aspect, an apparatus may include a metal layer having a metal pitch between metal elements, and a gate electrode layer having a gate pitch between gate electrode elements, wherein the gate electrode pitch is a ratio of the metal pitch. The apparatus may include at least two power rails coupled, by via staples, with the metal layer, wherein the via staples at least partially overlap one or more of the gate electrode elements. The apparatus may include even and odd pluralities of standard cells, each respectively located in even/odd placement sites wherein portions of the standard cells that carry signals within the metal layer do not connect to the via staples.
    Type: Application
    Filed: February 12, 2019
    Publication date: December 19, 2019
    Inventors: Matthew BERZINS, Andrew Paul HOOVER, Christopher Alan PEURA