Patents by Inventor Christopher Apanius
Christopher Apanius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230167311Abstract: The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating layer deposited from a powder coating composition including a film-forming resin, and optionally a thermally conductive, electrically insulative filler material and/or a crosslinker that is reactive with the film-forming resin, in direct contact with at least a portion of the substrate to which the first material has been applied. The first material is (i) a catalyst that catalyzes cure of the powder coating composition, (ii) a component reactive with the film-forming resin and/or the crosslinker of the powder coating composition, and/or (iii) a rheology modifier.Type: ApplicationFiled: February 26, 2021Publication date: June 1, 2023Applicant: PPG Industries Ohio, Inc.Inventors: Brian E. Woodworth, John R. Schneider, Anthony M. Chasser, Liang Ma, Calum H. Munro, Marvin M. Pollum, Jr., Maria S. French, Allison G. Condie, Holli A. Gonder-Jones, Daniel K. Dei, Christopher Apanius, Cassandra Noelle Bancroft
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Publication number: 20230143426Abstract: The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.Type: ApplicationFiled: February 26, 2021Publication date: May 11, 2023Applicant: PPG Industries Ohio, Inc.Inventors: Sijmen J. Visser, Brian E. Woodworth, Holli A. Gonder-Jones, John R. Schneider, Kelly L. Moore, Mark L. Follet, Liang Ma, Calum H. Munro, Marvin M. Pollum, JR., Maria S. French, Allison G. Condie, Amy E. Harrison, Irina G. Schwendeman, Daniel K. Dei, Cassandra Noelle Bancroft, Christopher Apanius, Kevin T. Sylvester, Corey J. Dedomenic, Egle Puodziukynaite
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Publication number: 20230115050Abstract: The present invention is directed towards a powder coating composition comprising a binder; a thermally conductive, electrically insulative filler material; and, optionally, a thermoplastic material and/or a core-shell polymer. The present invention is also directed to a substrate comprising a coating layer deposited from the powder coating composition of the present invention, as well as methods of coating a substrate.Type: ApplicationFiled: February 26, 2021Publication date: April 13, 2023Applicant: PPG Industries Ohio, Inc.Inventors: Liang Ma, Calum H. Munro, Marvin M. Pollum, JR., Daniel K. Dei, Brian E. Woodworth, John R. Schneider, Maria S. French, Allison G. Condie, Holli A. Gonder-Jones, Christopher Apanius, Cassandra Noelle Bancroft
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Patent number: 9765200Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.Type: GrantFiled: August 13, 2013Date of Patent: September 19, 2017Assignee: PROMERUS, LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Patent number: 9562124Abstract: The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized and an additive package containing a phenolic antioxidant and a diaryl amine synergist, and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.Type: GrantFiled: July 13, 2016Date of Patent: February 7, 2017Assignees: PROMERUS, LLC, SUMITOMO BAKELITE CO., LTD.Inventors: Christopher Apanius, Andrew Bell, Cheryl Burns, Crystal Cyrus, Edmund Elce, Royce Groff, Sridevi Kaiti, Brian Knapp, Hendra Ng, Seishi Ohashi, Wei Zhang
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Publication number: 20160319060Abstract: The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized where such the PNBs of such compositions and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.Type: ApplicationFiled: July 13, 2016Publication date: November 3, 2016Applicants: PROMERUS, LLC, SUMITOMO BAKELITE CO., LTD.Inventors: CHRISTOPHER APANIUS, ANDREW BELL, CHERYL BURNS, CRYSTAL CYRUS, EDMUND ELCE, ROYCE GROFF, SRIDEVI KAITI, BRIAN KNAPP, HENDRA NG, SEISHI OHASHI, WEI ZHANG
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Patent number: 9425404Abstract: The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized and an additive package containing a phenolic antioxidant and a synergist, and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.Type: GrantFiled: January 15, 2013Date of Patent: August 23, 2016Assignees: PROMERUS, LLC, SUMITOMO BAKELITE CO., LTD.Inventors: Christopher Apanius, Andrew Bell, Cheryl Burns, Crystal Cyrus, Edmund Elce, Royce Groff, Sridevi Kaiti, Brian Knapp, Hendra Ng, Seishi Ohashi, Wei Zhang
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Patent number: 9263416Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.Type: GrantFiled: August 12, 2014Date of Patent: February 16, 2016Assignee: SUMITOMO BAKELITE CO., LTD.Inventors: Christopher Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phillip S. Neal
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Publication number: 20140349446Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.Type: ApplicationFiled: August 12, 2014Publication date: November 27, 2014Applicant: PROMERUS, LLCInventors: CHRISTOPHER APANIUS, ROBERT A. SCHICK, HENDRA NG, ANDREW BELL, WEI ZHANG, PHILLIP S. NEAL
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Patent number: 8729166Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.Type: GrantFiled: September 27, 2013Date of Patent: May 20, 2014Assignee: Promerus, LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Publication number: 20140024750Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.Type: ApplicationFiled: September 27, 2013Publication date: January 23, 2014Applicant: Promerus, LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Publication number: 20130327815Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.Type: ApplicationFiled: August 13, 2013Publication date: December 12, 2013Applicant: Promerus, LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Patent number: 8575248Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.Type: GrantFiled: August 5, 2011Date of Patent: November 5, 2013Assignee: Promerus, LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Patent number: 8535454Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.Type: GrantFiled: November 18, 2011Date of Patent: September 17, 2013Assignee: Promerus, LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Publication number: 20120298729Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.Type: ApplicationFiled: November 18, 2011Publication date: November 29, 2012Applicant: Promerus LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Publication number: 20120034387Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.Type: ApplicationFiled: August 5, 2011Publication date: February 9, 2012Applicant: Promerus LLCInventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Patent number: 8030425Abstract: Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R1, R2, R3, and R4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.Type: GrantFiled: December 3, 2008Date of Patent: October 4, 2011Assignee: Promerus LLCInventors: Christopher Apanius, Matthew Apanius, Edmund Elce, Hendra Ng, Brian Knapp, Takashi Hirano, Junya Kusunoki, Robert Shick
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Publication number: 20090189277Abstract: Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R1, R2, R3, and R4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.Type: ApplicationFiled: December 3, 2008Publication date: July 30, 2009Applicant: PROMERUS LLCInventors: Christopher Apanius, Matthew Apanius, Edmund Elce, Hendra Ng, Brian Knapp, Takashi Hirano, Junya Kusunoki, Robert A. Shick
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Patent number: 7203394Abstract: A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.Type: GrantFiled: July 15, 2003Date of Patent: April 10, 2007Assignee: Rosemount Aerospace Inc.Inventors: Thomas Wiegele, Christopher Apanius, Kenneth G. Goldman, Shuwen Guo, Loren E. St. Clair, Timothy R. O'Meara, James J. Pohl
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Publication number: 20050013533Abstract: A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.Type: ApplicationFiled: July 15, 2003Publication date: January 20, 2005Inventors: Thomas Wiegele, Christopher Apanius, Kenneth Goldman, Shuwen Guo, Loren St. Clair, Timothy O'Meara, James Pohl