Patents by Inventor Christopher B. D'Aleo

Christopher B. D'Aleo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via chains for defect localization
    Patent number: 9564379
    Abstract: Via chain and serpentine/comb test structures are in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: February 7, 2017
    Assignees: International Business Machines Corporation, STMicroelectronics, Inc.
    Inventors: Balasingham Bahierathan, Christopher B. D'Aleo, Gregory M. Johnson, Muthukumaraamy Karthikeyan, Shenzhi Yang
  • VIA CHAINS FOR DEFECT LOCALIZATION
    Publication number: 20130299828
    Abstract: Via chain and serpentine/comb test structures are in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area.
    Type: Application
    Filed: July 16, 2013
    Publication date: November 14, 2013
    Inventors: Balasingham Bahierathan, Christopher B. D'Aleo, Gregory M. Johnson, Muthukumaraamy Karthikeyan, Shenzhi Yang
  • Via chains for defect localization
    Patent number: 8546155
    Abstract: Method form via chain and serpentine/comb test structures in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area. The methods perform relatively low (first) magnification testing to identify a defective geometrically shaped portion that contains a defective via structure. The methods then perform relatively high (second) magnification testing only within the defective geometrically shaped portion. The first magnification testing is performed at a lower magnification relative to the second magnification testing.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: October 1, 2013
    Assignees: International Business Machines Corporation, STMicroelectronics, Inc.
    Inventors: Christopher B. D'Aleo, Gregory M. Johnson, Muthukumarasamy Karthikeyan, Shenzhi Yang, Balasingham Bahierathan
  • VIA CHAINS FOR DEFECT LOCALIZATION
    Publication number: 20130082257
    Abstract: Method form via chain and serpentine/comb test structures in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area. The methods perform relatively low (first) magnification testing to identify a defective geometrically shaped portion that contains a defective via structure. The methods then perform relatively high (second) magnification testing only within the defective geometrically shaped portion. The first magnification testing is performed at a lower magnification relative to the second magnification testing.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 4, 2013
    Applicants: ST MICROELECTRONICS, INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bahierathan Balasingham, Christopher B. D'Aleo, Gregory M. Johnson, Muthukumarasamy Karthikeyan, Shenzhi Yang