Abstract: A system for detecting proximity between a first transceiver and a second transceiver. Each of the first and the second transceivers includes at least one primary and secondary radio module. The primary radio module of the first transceiver is able to communicate with the primary radio module of the second transceiver, and the secondary radio module of the first transceiver is able to communicate with the secondary radio module of the second transceiver. The first and the second transceivers are configured to estimate a primary communication distance between the primary radio module of the first transceiver and the primary radio module of the second transceiver, and estimate a secondary communication distance between the secondary radio module of the first transceiver and the secondary radio module of the second transceiver.

Abstract: Apparatus for transmitting and/or receiving radiofrequency signals comprising at least a broadband antenna (310) and a substrate (410); the antenna (310) comprising at least a first radiating surface (318) and being superimposed on the ground plane, the ground plane being located on a first face of the substrate (410), at least a side tongue of power supply (314) and at least a side wall (316) connected to at least the first radiating surface (318), the apparatus being characterized in that the side wall (316) is connected to a coupling trace (416) located on a second face of the substrate (410), opposite to the first face of the substrate (410), and the side wall (316) and the coupling trace (416) being configured to act as a capacitive coupling between at least the first radiating surface (318) and the ground plane.

Abstract: Apparatus for transmitting and/or receiving radiofrequency signals comprising at least a broadband antenna (310) and a substrate (410); the antenna (310) comprising at least a first radiating surface (318) and being superimposed on the ground plane, the ground plane being located on a first face of the substrate (410), at least a side tongue of power supply (314) and at least a side wall (316) connected to at least the first radiating surface (318), the apparatus being characterized in that the side wall (316) is connected to a coupling trace (416) located on a second face of the substrate (410), opposite to the first face of the substrate (410), and the side wall (316) and the coupling trace (416) being configured to act as a capacitive coupling between at least the first radiating surface (318) and the ground plane.

Abstract: The present invention concerns phosphodiesterase inhibitors which may be used to modulate sperm motility, activity and/or function. The invention provides modulators of PDE1Ga which may be used to modulate the physiological processes occurring within a sperm cell. The method includes contacting the sperm with a modulator of PDE1Ga activity or function.

Abstract: An electronic device with an antenna of the antenna-in-package type (AIP) includes an upper surface on which a radiating element is provided. The radiating element has an open end and a feeding end. The antenna also includes an adaptation element. The antenna is characterized in that the adaptation element is provided at an area that is different from the upper surface of the antenna holding the radiating element. The adaptation element is connected, at one end, to an intermediate point of the radiating element and grounded at another end. The device allows a further size reduction of standard inverted F antennas (IFA).

Abstract: An electronic device with an antenna of the antenna-in-package type (AIP) includes an upper surface on which a radiating element is provided. The radiating element has an open end and a feeding end. The antenna also includes an adaptation element. The antenna is characterized in that the adaptation element is provided at an area that is different from the upper surface of the antenna holding the radiating element. The adaptation element is connected, at one end, to an intermediate point of the radiating element and grounded at another end. The device allows a further size reduction of standard inverted F antennas (IFA).

Abstract: A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.

Abstract: A multilayered, low temperature co-fired ceramic (LTCC) substrate within which a radio frequency (RF) filter is formed. Portions of a bandpass filter are implemented using electrode patterns on different ceramic tape layers of which selected portions are mutually superimposed, thereby providing self-compensation for changes in mutual coupling (e.g., mutual inductance) caused by small errors in alignment of the ceramic tape layers occurring during manufacturing.

Abstract: A multilayered, low temperature co-fired ceramic (LTCC) substrate within which one or more capacitors are formed (e.g., for power supply decoupling). Self-resonance is introduced by the capacitance of each capacitor interacting with an inductance formed by the interconnects (e.g., conductive vias and other conductive interconnects among the electrode patterns), which couple such capacitor to its respective circuit electrode and interface electrode (e.g., ground reference).

Abstract: A multilayered, low temperature co-fired ceramic (LTCC) substrate within which a radio frequency (RF) filter is formed. Portions of a bandpass filter are implemented using electrode patterns on different ceramic tape layers of which selected portions maintain a symmetrical physical filter structure, thereby providing self-compensation for changes in mutual coupling (e.g., mutual inductance) caused by small errors in alignment of the ceramic tape layers occurring during manufacturing.

Abstract: A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.

Abstract: A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.

Abstract: A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.