Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.

Abstract: The disclosed technology relates generally to designs and methods of assembling devices utilizing compound micro-assembly. Functional elements are micro-assembled to form an array of individual micro-systems on an intermediate substrate, then the microsystems are transferred (one or more at a time) to a destination or device substrate. For example, for a display device, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit. An array of pixels may be formed by micro-transfer printing functional elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.

Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

Abstract: An apparatus comprising at least one light source, at least one photodetector, a first layer of optical material configured to embed the at least one light source, and a second layer of optical material configured to embed the at least one photodetector. The first and second layer of optical material are configured to guide light from the at least one light source and to prevent the light from the at least one light source directly reaching the at least on photodetector, and the second layer of optical material is configured to guide light towards the at least one photodetector.

Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.