Patents by Inventor Christopher Bower

Christopher Bower has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250078160
    Abstract: In order to provide agile and dynamic portfolio management, systems and methods for underwriting and portfolio management include an ecosystem including a platform, including processing devices, communication interfaces, runtime environments, and databases, where the databases are configured to store ecosystem data, where the ecosystem data includes data associated with a plurality of systems. A service layer is in communication with the platform, the service layer including containers executed in the runtime environment and configured to implement microservices, where each of the containers include: at least one microservice and a datastore device configured to store domain-specific data. An orchestrator is in communication with the service layer, the orchestrator to schedule execution of the microservices according to bounded contexts coordinated with composite application programming interfaces (API) interfacing with a microservice specific API.
    Type: Application
    Filed: November 18, 2024
    Publication date: March 6, 2025
    Inventors: Jim Brocato, Alberto Silva, Victor Lombardi, Christopher Bowers
  • Patent number: 12148042
    Abstract: In order to provide agile and dynamic portfolio management, systems and methods for underwriting and portfolio management include an ecosystem including a platform, including processing devices, communication interfaces, runtime environments, and databases, where the databases are configured to store ecosystem data, where the ecosystem data includes data associated with a plurality of systems. A service layer is in communication with the platform, the service layer including containers executed in the runtime environment and configured to implement microservices, where each of the containers include: at least one microservice and a datastore device configured to store domain-specific data. An orchestrator is in communication with the service layer, the orchestrator to schedule execution of the microservices according to bounded contexts coordinated with composite application programming interfaces (API) interfacing with a microservice specific API.
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: November 19, 2024
    Assignee: Capital One Services, LLC
    Inventors: Jim Brocato, Alberto Silva, Victor Lombardi, Christopher Bowers
  • Patent number: 12080690
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: November 13, 2023
    Date of Patent: September 3, 2024
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 12068739
    Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: August 20, 2024
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Publication number: 20240213238
    Abstract: The disclosed technology relates generally to designs and methods of assembling devices utilizing compound micro-assembly. Functional elements are micro-assembled to form an array of individual micro-systems on an intermediate substrate, then the microsystems are transferred (one or more at a time) to a destination or device substrate. For example, for a display device, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit. An array of pixels may be formed by micro-transfer printing functional elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.
    Type: Application
    Filed: February 5, 2024
    Publication date: June 27, 2024
    Inventors: Christopher Bower, Matthew Meitl
  • Publication number: 20240170430
    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 23, 2024
    Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
  • Patent number: 11990438
    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: May 21, 2024
    Assignee: X Display Company Technology Limited
    Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
  • Publication number: 20240153927
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 9, 2024
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 11854788
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: December 26, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Publication number: 20230267547
    Abstract: In order to provide agile and dynamic portfolio management, systems and methods for underwriting and portfolio management include an ecosystem including a platform, including processing devices, communication interfaces, runtime environments, and databases, where the databases are configured to store ecosystem data, where the ecosystem data includes data associated with a plurality of systems. A service layer is in communication with the platform, the service layer including containers executed in the runtime environment and configured to implement microservices, where each of the containers include: at least one microservice and a datastore device configured to store domain-specific data. An orchestrator is in communication with the service layer, the orchestrator to schedule execution of the microservices according to bounded contexts coordinated with composite application programming interfaces (API) interfacing with a microservice specific API.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 24, 2023
    Inventors: Jim Brocato, Alberto Silva, Victor Lombardi, Christopher Bowers
  • Patent number: 11651435
    Abstract: In order to provide agile and dynamic portfolio management, systems and methods for underwriting and portfolio management include an ecosystem including a platform, including processing devices, communication interfaces, runtime environments, and databases, where the databases are configured to store ecosystem data, where the ecosystem data includes data associated with a plurality of systems. A service layer is in communication with the platform, the service layer including containers executed in the runtime environment and configured to implement microservices, where each of the containers include: at least one microservice and a datastore device configured to store domain-specific data. An orchestrator is in communication with the service layer, the orchestrator to schedule execution of the microservices according to bounded contexts coordinated with composite application programming interfaces (API) interfacing with a microservice specific API.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: May 16, 2023
    Assignee: Capital One Services, LLC
    Inventors: Jim Brocato, Alberto Silva, Victor Lombardi, Christopher Bowers
  • Publication number: 20230146788
    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 11, 2023
    Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
  • Patent number: 11552034
    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: January 10, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
  • Patent number: 11496391
    Abstract: Problems associated with providing a large Clos network having at least one top of fabric (ToF) node, a plurality of internal nodes, and a plurality of leaf nodes may be solved by: (a) providing L2 tunnels between each of the leaf nodes of the Clos and one or more of the at least one ToF node to ensure a non-partitioned IGP L2 backbone, and (b) identifying the L2 tunnels as non-forwarding adjacencies in link state topology information stored in ToF node(s) and leaf node(s) such that the L2 tunnels are not used for forwarding traffic. Tunnel formation is prevented over L2.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: November 8, 2022
    Assignee: Juniper Networks, Inc.
    Inventors: Antoni B. Przygienda, Russ White, Christopher Bowers
  • Patent number: 11495560
    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: November 8, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
  • Patent number: 11472171
    Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: October 18, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
  • Patent number: 11469259
    Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: October 11, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Etienne Menard, Matthew Meitl, Joseph Carr
  • Publication number: 20220216413
    Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.
    Type: Application
    Filed: February 15, 2022
    Publication date: July 7, 2022
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 11374086
    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: June 28, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, Carl Prevatte, Ronald S. Cok
  • Patent number: 11289652
    Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: March 29, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok