Abstract: An electrical distribution center includes a housing formed of an electrically nonconductive material, an electromagnetic housing shield formed of an electrically conductive material disposed within a cavity in the housing, a cover enclosing the cavity having an electromagnetic cover shield formed of the electrically conductive material and in electrical contact with the housing shield, and a plurality of shielded electrical connectors interconnected to one another through electrical components contained within the cavity. The electrical components are mounted on a plurality of standoffs defined by an inner surface of the housing. The plurality of standoffs extends through a plurality of apertures defined in the housing shield.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.