Abstract: An extrusion die includes: a cylindrical mandrel, the mandrel having a circumferential groove formed therein; a cylindrical die plate, the mandrel and the die plate being coupled together; and a shrink ring disposed in the circumferential groove of the mandrel.

Abstract: An extrusion die includes: a cylindrical mandrel, the mandrel having a circumferential groove formed therein; a cylindrical die plate, the mandrel and the die plate being coupled together; and a shrink ring disposed in the circumferential groove of the mandrel.

Abstract: A part packaging system and method includes a package blank formed as a single sheet of foldable material having fold lines disposed thereon and cutout portions defined therein for enabling the package blank to be folded into a configuration of an enclosed package. The system further includes a jig configured to complementarily receive the package blank and facilitate folding of the package blank into the enclosed package. The jig includes contact portions that correspond to the fold lines of the package blank such that pressure applied to the package blank when received in the jig causes the package blank to fold along the fold lines toward the configuration of the enclosed package.

Abstract: The present invention provides a method for manufacturing a device, as well as a method for manufacturing an integrated circuit. The method for manufacturing the device, among others, may include forming one or more devices of a first type over a substrate using imprint lithography, and forming one or more devices of a second type over the substrate using a direct write technology.

Abstract: In a system including a plurality of diverse semiconductor manufacturing facilities, each of the facilities having a respective manufacturing process requiring semiconductor specific design information in a corresponding diverse format, a method for supplying data to each of the facilities in an appropriate format includes establishing a database for each of the plurality of facilities, the database identifying the appropriate format for each of the facilities. The method also includes receiving semiconductor specific design information and converting the design information in accordance with the appropriate format for one of selected ones of the facilities. The method further includes providing a respective tapeout to said one of the selected ones of the facilities, each tapeout comprising the design information formatted in the appropriate format for the respective facility receiving the tapeout.

Abstract: A collapsible, foldable, mask is provided which is made from a single blank, creased or folded to make a front and a back panel, with the fold forming the tops of both panels. The sides of the front panel are joined for a portion of their length to the corresponding sides of the back panel. The mask can be stored or shipped in a flat two-dimensional, partly assembled mode and can be opened or assembled to their dimensional form to be worn on the head of a user.