Patents by Inventor Christopher C. Aschoff

Christopher C. Aschoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Print head die slot ribs
    Patent number: 8262204
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: September 11, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Methods of controlling flow
    Patent number: 7655275
    Abstract: A method of controlling flow includes treating a region of a surface to have a non-wettable surface characteristic or a wettable surface characteristic in the region.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: February 2, 2010
    Assignee: Hewlett-Packard Delopment Company, L.P.
    Inventors: Curtis L. Nelson, Brian G. Risch, Charles C. Haluzak, Christopher C. Aschoff
  • PRINT HEAD DIE SLOT RIBS
    Publication number: 20090096845
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Fluid ejection device and method of manufacturing a fluid ejection device
    Patent number: 6764165
    Abstract: A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: July 20, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christopher C. Aschoff, William R. Boucher, Paul F. Reboa, Gilbert G. Smith, John M. Altendorf
  • Fluid ejection device and method of manufacturing a fluid ejection device
    Publication number: 20040061741
    Abstract: A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 1, 2004
    Inventors: Christopher C. Aschoff, William R. Boucher, Paul F. Reboa, Gilbert G. Smith, John M. Altendorf