Abstract: A coating agent for forming an oxide film; a method for producing an oxide film; and a method for producing a metal-plated structure, where the stability of the coating agent can be enhanced, and an oxide film which can be plated and has high adhesion to a substrate can be easily formed. The coating agent for forming an oxide film is a liquid coating agent, essentially contains titanium atoms, and optionally contains silicon atoms and copper atoms, wherein the ratio of the sum of the titanium atoms and copper atoms to the silicon atoms is 1:0-3:2. The method for producing an oxide film includes applying the coating agent to a substrate and heating to form an oxide film. The method for producing a metal-plated structure includes: a metal-film-forming step for forming a metal film on the oxide film; and a baking step for baking the metal film.

Abstract: A coating agent for forming a metal oxide film, which contains an organic solvent that is different from N,N-dimethyl acetamide (DMA) or N-methyl pyrrolidone (NMP), and which has excellent conformal coating properties; and a method for producing a substrate having a metal oxide film. A coating agent for forming a metal oxide film, which contains a solvent and a metal, and wherein the solvent contains a compound (A) represented by formula (1). In formula (1), each of R1 and R2 independently represents an alkyl group having 1-3 carbon atoms; and R3 represents a group represented by formula (1-1) or formula (1-2). In formula (1-1), R4 represents a hydrogen atom or a hydroxyl group; and each of R5 and R6 independently represents an alkyl group having 1-3 carbon atoms. In formula (1-2), each of R7 and R8 independently represents a hydrogen atom or an alkyl group having 1-3 carbon atoms.

Abstract: A non-cyanide gold plating bath 1 contains gold ions and a compound represented by the following chemical formula (chem 1):

Abstract: An electroless plating method of an embodiment includes: a step of preparing a catalyst solution containing titanium alkoxide, a copper ion, a naphthoquinonediazide esterification product, and methoxyethoxyacetic acid; a step of coating a substrate with the catalyst solution; a step of patterning the coating film; a step of converting the coating film to a catalyst precursor film; a step of immersing the catalyst precursor film in a reducing agent-containing aqueous solution to reduce the copper ion to metal; and a step of forming an electroless copper plating film.

Abstract: A layer of a metal selected from titanium, niobium, tungsten, molybdenum, ruthenium, rhodium, arsenic, aluminum and gallium, an oxide of the metal, a nitride of the metal, silicon nitride, hafnium nitride, tantalum nitride, or an alloy of these metals, the layer being provided on an underlying base material selected from glass, silicon, copper and nickel, is selectively etched with an alkaline etching solution containing a predefined complexing agent.

Abstract: Disclosed is a method for forming a photocatalyst thin film, which is characterized in that a photocatalyst thin film containing a niobium-alkali metal complex oxide is formed by forming and then firing a layer containing niobium on the surface of a base containing an alkali metal.

Abstract: A non-cyanide gold plating bath 1 contains gold ions and a compound represented by the following chemical formula (chem 1):

Abstract: Disclosed is a method for forming a photocatalyst thin film, which is characterized in that a photocatalyst thin film containing a niobium-alkali metal complex oxide is formed by forming and then firing a layer containing a niobia nanosheet on the surface of a base containing an alkali metal.

Abstract: A layer of a metal selected from titanium, niobium, tungsten, molybdenum, ruthenium, rhodium, arsenic, aluminum and gallium, an oxide of the metal, a nitride of the metal, silicon nitride, hafnium nitride, tantalum nitride, or an alloy of these metals, the layer being provided on an underlying base material selected from glass, silicon, copper and nickel, is selectively etched with an alkaline etching solution containing a predefined complexing agent.

Abstract: A coating liquid including one or more of metal complexes selected from a metal complex A represented by Chemical Formula 1, a metal complex B represented by Chemical Formula 2, and a metal complex C represented by Chemical Formula 3. M in Formula 1, 2 and 3 represents a metal ion. Each of X1-X4 in Formula 1, 2 and 3 is one of O, NH, CO2 and S. Each of Y1-Y8 in Formula 1 and Y1-Y4 in Formula 3 is either CH or N. Each of Z1-Z3 in Formula 2 and 3 and Z4-Z6 in Formula 2 is one selected from a group of O, NH and S, and two selected from a group of CH and N. L represents an axial ligand. k represents a valence of each of the metal complexes and is equal to a sum of electric charges of M, X1-X4 and L.

Abstract: Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.

Abstract: The present invention provides a technology related to a conductive film which is high in transparency, conductivity, and adhesiveness to a base plate. The present invention also provides a coating liquid including metal materials reacting with a ligand represented by a particular Chemical Formula and including indium (In), tin (Sn), or both thereof.

Abstract: The present invention provides a coating liquid including organic metal complexes represented by Chemical Formula 1. R1-R8 in Chemical Formula 1 is one of the followings (1)-(4): (1) a group represented by CnH2n+1 (aforementioned n is an integral number equal to or larger than 0); (2) a group represented by COOR9 (aforementioned R9 is a group represented by CmH2m+1, and aforementioned m is an integral number equal to or larger than 0); (3) a halogen atom; and (4) CN or NO2.

Abstract: The present invention provides a coating liquid including organic metal complexes represented by Chemical Formula 1. R1-R8 in Chemical Formula 1 is one of the followings (1)-(4): (1) a group represented by CnH2n+1 (aforementioned n is an integral number equal to or larger than 0); (2) a group represented by COOR9 (aforementioned R9 is a group represented by CmH2m+1, and aforementioned m is an integral number equal to or larger than 0); (3) a halogen atom; and (4) CN or NO2.

Abstract: Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.

Abstract: Disclosed is a method for forming a photocatalyst thin film, which is characterized in that a photocatalyst thin film containing a niobium-alkali metal complex oxide is formed by forming and then firing a layer containing a niobia nanosheet on the surface of a base containing an alkali metal.

Abstract: Disclosed is a method for forming a photocatalyst thin film, which is characterized in that a photocatalyst thin film containing a niobium-alkali metal complex oxide is formed by forming and then firing a layer containing niobium on the surface of a base containing an alkali metal.

Abstract: The present invention provides a technology related to a conductive film which is high in transparency, conductivity, and adhesiveness to a base plate. The present invention also provides a coating liquid including metal materials reacting with a ligand represented by Chemical Formula 1 and including indium (In), tin (Sn), or both thereof. Each of R21—R24 in the Chemical Formula 1 is one of the followings (1)-(11) and X11 and X12 is either hetero atoms or carboxylic acid.

Abstract: A coating liquid including one or more of metal complexes selected from a metal complex A represented by Chemical Formula 1, a metal complex B represented by Chemical Formula 2, and a metal complex C represented by Chemical Formula 3. M in Chemical Formula 1, Chemical Formula 2 and Chemical Formula 3 represents a metal ion. Each of X1-X4 in Chemical Formula 1, Chemical Formula 2 and Chemical Formula 3 is one of O, NH, CO2 and S. Each of Y1-Y8 in Chemical Formula 1 and Y1-Y4 in Chemical Formula 3 is either CH or N. Each of Z1-Z3 in Chemical Formula 2 and Chemical Formula 3 and Z4-Z6 in Chemical Formula 2 is one selected from a group of O, NH and S, and two selected from a group of CH and N. L in Chemical Formula 1, Chemical Formula 2 and Chemical Formula 3 represents an axial ligand. k in Chemical Formula 1, Chemical Formula 2 and Chemical Formula 3 represents a valence of each of the metal complexes and is equal to a sum of electric charges of M, X1-X4 and L.

Abstract: The present invention provides a coating liquid including organic metal complexes represented by Chemical Formula 1. R1-R8 in Chemical Formula 1 is one of the followings (1)-(4): (1) a group represented by CnH2n+1 (aforementioned n is an integral number equal to or larger than 0); (2) a group represented by COOR9 (aforementioned R9 is a group represented by CmH2m+1, and aforementioned m is an integral number equal to or larger than 0); (3) a halogen atom; and (4) CN or NO2.