Patents by Inventor Christopher D. Cotton

Christopher D. Cotton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230185681
    Abstract: A fault tolerant computer system and method are disclosed. The system may include a plurality of CPU nodes, each including: a processor and a memory; at least two IO domains, wherein at least one of the IO domains is designated an active IO domain performing communication functions for the active CPU nodes; and a switching fabric connecting each CPU node to each IO domain. One CPU node is designated a standby CPU node and the remainder are designated as active CPU nodes. If a failure, a beginning of a failure, or a predicted failure occurs in an active node, the state and memory of the active CPU node are transferred to the standby CPU node which becomes the new active CPU node. If a failure occurs in an active IO domain, the communication functions performed by the failing active IO domain are transferred to the other IO domain.
    Type: Application
    Filed: February 7, 2023
    Publication date: June 15, 2023
    Applicant: STRATUS TECHNOLOGIES IRELAND LTD.
    Inventors: Chester W. Pawlowski, John M. Chaves, Andrew Alden, Craig D. Keefer, Christopher D. Cotton, Michael Egan
  • Patent number: 11586514
    Abstract: A fault tolerant computer system and method are disclosed. The system may include a plurality of CPU nodes, each including: a processor and a memory; at least two IO domains, wherein at least one of the IO domains is designated an active IO domain performing communication functions for the active CPU nodes; and a switching fabric connecting each CPU node to each IO domain. One CPU node is designated a standby CPU node and the remainder are designated as active CPU nodes. If a failure, a beginning of a failure, or a predicted failure occurs in an active node, the state and memory of the active CPU node are transferred to the standby CPU node which becomes the new active CPU node. If a failure occurs in an active IO domain, the communication functions performed by the failing active IO domain are transferred to the other IO domain.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: February 21, 2023
    Inventors: Chester W. Pawlowski, John M. Chaves, Andrew Alden, Craig D. Keefer, Christopher D. Cotton, Michael Egan
  • Publication number: 20200050523
    Abstract: A fault tolerant computer system and method are disclosed. The system may include a plurality of CPU nodes, each including: a processor and a memory; at least two IO domains, wherein at least one of the IO domains is designated an active IO domain performing communication functions for the active CPU nodes; and a switching fabric connecting each CPU node to each IO domain. One CPU node is designated a standby CPU node and the remainder are designated as active CPU nodes. If a failure, a beginning of a failure, or a predicted failure occurs in an active node, the state and memory of the active CPU node are transferred to the standby CPU node which becomes the new active CPU node. If a failure occurs in an active IO domain, the communication functions performed by the failing active IO domain are transferred to the other IO domain.
    Type: Application
    Filed: August 9, 2019
    Publication date: February 13, 2020
    Applicant: STRATUS TECHNOLOGIES BERMUDA, LTD.
    Inventors: Chester W. Pawlowski, John M. Chaves, Andrew Alden, Craig D. Keefer, Christopher D. Cotton, Michael Egan
  • Patent number: 6888218
    Abstract: The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: May 3, 2005
    Assignee: The Raytheon Company
    Inventors: Dennis R. Kling, Christopher D. Cotton, Bruce W. Chignola
  • Publication number: 20020048927
    Abstract: The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.
    Type: Application
    Filed: October 10, 2001
    Publication date: April 25, 2002
    Applicant: The Raytheon Company
    Inventors: Dennis R. Kling, Christopher D. Cotton, Bruce W. Chignola