Patents by Inventor Christopher D. Dobson

Christopher D. Dobson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for filing substrate recesses using elevated temperature and pressure
    Patent number: 5527561
    Abstract: To fill a hole or trench structure in an article, such as a semiconductor wafer, a layer is formed on the article. The layer extends over the structure so as to seal the mouth thereof. Then, the wafer and layer are subject to elevated pressure and elevated temperature such as to cause material of the layer to flow into the structure.
    Type: Grant
    Filed: August 16, 1994
    Date of Patent: June 18, 1996
    Assignee: Electrotech Limited
    Inventor: Christopher D. Dobson