Abstract: A receptacle assembly with improved EMI leakage reduction and construction is described. The assembly includes a housing in the form of a guide frame that has a hollow interior which accommodates the insertion of an electronic module therein. A heat sink is provided to dissipate heat generated during operation of a module and the heat sink has a base portion that defines a ceiling of the hollow interior. An opening in the top of the guide frame provides an attachment location for the heat sink. A separately formed base plate is inserted into the housing and it defines a bottom of the interior of the housing.

Abstract: A compliant pin for use with a shielding cage or electrical connector is disclosed that has improved insertion capabilities that increase the resistance of the compliant pin to buckling during mounting of the cage or connector to a circuit board. The pin has a base and tip portion that are interconnected together by a body portion. An opening is disposed in the pin body portion and the top edge of the opening is positioned at a level therein that is spaced apart from and beneath the top surface of the circuit board. In another embodiment, the pin opening is generally non-symmetrical with a configuration that approximates a triangle, i.e., the wider base portion of the pin opening is closer to the pin tip portion than the narrower, apex portion of the pin opening.

Abstract: A receptacle assembly with improved EMI leakage reduction and construction is described. The assembly includes a housing in the form of a guide frame that has a hollow interior which accommodates the insertion of an electronic module therein. A heat sink is provided to dissipate heat generated during operation of a module and the heat sink has a base portion that defines a ceiling of the hollow interior. An opening in the top of the guide frame provides an attachment location for the heat sink. A separately formed base plate is inserted into the housing and it defines a bottom of the interior of the housing.