Patents by Inventor Christopher D. Manack

Christopher D. Manack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for embedding controlled-cavity MEMS package in integration board
    Patent number: 8866237
    Abstract: An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: October 21, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Christopher D. Manack, Frank Stepniak, Sreenivasan K. Koduri
  • Methods for Embedding Controlled-Cavity MEMS Package in Integration Board
    Publication number: 20130221455
    Abstract: An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.
    Type: Application
    Filed: February 27, 2012
    Publication date: August 29, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Christopher D. Manack, Frank Stepniak, Sreenivasan K. Koduri
  • Structure and method for sealing cavity of micro-electro-mechanical device
    Patent number: 7919842
    Abstract: A cavity package (100) for micrometer-scale MEMS devices surrounding the cavity (210) with the MEMS device (220) with a rim (232) of solder-wettable metal, and then covering the cavity with a roof (240) of solder spanning from rim to rim. A solder body, placed over the cavity to rest on the rim, is reflowed; the surface tension of the liquid solder is reduced by the interfacial tension of the rim metal so that the liquid solder spreads over the rim surface and thereby stretches the liquid ball to a plate-like roof over the cavity. After solidifying the solder, the solder-to-metal seal renders the cavity package hermetic.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: April 5, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Christopher D. Manack, Steven A. Kummerl
  • Structure and Method for Sealing Cavity of Micro-Electro-Mechanical Device
    Publication number: 20100237489
    Abstract: A cavity package (100) for micrometer-scale MEMS devices surrounding the cavity (210) with the MEMS device (220) with a rim (232) of solder-wettable metal, and then covering the cavity with a roof (240) of solder spanning from rim to rim. A solder body, placed over the cavity to rest on the rim, is reflowed; the surface tension of the liquid solder is reduced by the interfacial tension of the rim metal so that the liquid solder spreads over the rim surface and thereby stretches the liquid ball to a plate-like roof over the cavity. After solidifying the solder, the solder-to-metal seal renders the cavity package hermetic.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 23, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Christopher D. Manack, Steven A. Kummerl