Abstract: Headset assemblies and headset connectors are provided. Headset connectors can include a magnetic mating face and a plurality of electrical contacts disposed within the mating face. Engaging assemblies and engaging connectors are also provided. The engaging connectors can include a housing having a mating side, a magnetic array structure, and a plurality of spring biased contact members. The magnetic array structure can be fixed within the housing and house a plurality of spring biased contact members. The spring biased contact members can include tips that extend out of the mating side. The tips can electrically couple with electrical contacts in a headset connector.

Abstract: Asymmetrically strengthened glass articles, methods for producing the same, and use of the articles in portable electronic device is disclosed. Using a budgeted amount of compressive stress and tensile stress, asymmetric chemical strengthening is optimized for the utility of a glass article. In some aspects, the strengthened glass article can be designed for reduced damage, or damage propagation, when dropped.

Abstract: Asymmetrically strengthened glass articles, methods for producing the same, and use of the articles in portable electronic device is disclosed. Using a budgeted amount of compressive stress and tensile stress, asymmetric chemical strengthening is optimized for the utility of a glass article. In some aspects, the strengthened glass article can be designed for reduced damage, or damage propagation, when dropped.

Abstract: Various embodiments provide apparatus and methods for melting materials and for containing the molten materials within melt zone during melting. Exemplary apparatus may include a vessel configured to receive a material for melting therein; a load induction coil positioned adjacent to the vessel to melt the material therein; and a containment induction coil positioned in line with the load induction coil. The material in the vessel can be heated by operating the load induction coil at a first RF frequency to form a molten material. The containment induction coil can be operated at a second RF frequency to contain the molten material within the load induction coil. Once the desired temperature is achieved and maintained for the molten material, operation of the containment induction coil can be stopped and the molten material can be ejected from the vessel into a mold through an ejection path.

Abstract: Systems and method for creating crystalline parts having a desired primary and secondary crystallographic orientations are provided. One embodiment may take the form of a method of manufacturing a part having a crystalline structure. The method includes melting aluminum oxide and drawing the melted aluminum oxide up a slit. Additionally, the method includes orienting the seed crystal relative to a growth apparatus such that a crystalline structure grows having a desired primary plane and a desired secondary plane orientation. Moreover, the method includes pulling the crystal as it forms to create a ribbon shaped crystalline structure and cutting a part from the crystalline structure.

Abstract: The embodiments described herein relate to BMG articles with high bulk having all dimensions greater than the critical dimension. Exemplary BMG article can include at least one bulk component and/or one or more fixation elements configured on surface of the bulk component or inserted into the bulk component. Other embodiments relate to methods of making the BMG articles by thermo-plastic-formation of BMG alloy materials.

Abstract: A layered coating for a sapphire component is described herein. The sapphire component comprises one or more layers of alumina adhered to the surface of a sapphire member. At least the first layer of alumina adheres to the surface of the sapphire member filling all defects in the surface forming a pristine new layer that also provides isolation from damage.

Abstract: An in-ear hearing device having an ear interfacing portion integrally formed with an elongated stem portion, wherein the ear interfacing portion extends away from the elongated stem portion; a first acoustic port formed in the ear interfacing portion; a speaker disposed in the ear interfacing portion and aligned to emit sound from the acoustic port; a plurality of electrical contacts disposed at an end of the stem portion, the plurality of electrical contacts including first and second contacts; a second acoustic port formed at the end of the elongated stem portion between the first and second contacts; a microphone disposed in the stem portion; and a channel that fluidically couples the microphone to the second acoustic port.

Abstract: Exemplary embodiments described herein relate to methods and apparatus for forming a coating layer at least partially on surface of a BMG article formed of bulk solidifying amorphous alloys. In embodiments, the coating layer may be formed in situ during formation of a BMG article and/or post formation of a BMG article. The coating layer may provide the BMG article with surface hardness, wear resistance, surface activity, corrosion resistance, etc.

Abstract: A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.

Abstract: An accessory may be provided with a button controller having a microphone and switches. Plastic structures for the accessory may be formed by injection molding. Plastic structures may be molded around switch terminals. Switches may be formed using dome switch members and the switch terminals. A printed circuit with components may be mounted in the plastic structures. Recesses in the structures may be configured to receive the dome switch members, components on the printed circuit board, and wires in a cable. A backplate may be used to cover the printed circuit. A layer of plastic may be molded over the backplate to seal an interface created by the backplate. Cable strain relief structures may be molded into the layer of plastic. A lip on the strain relief structures may prevent particles from entering the controller.

Abstract: Various embodiments provide methods and apparatus for forming bulk metallic glass (BMG) articles using a mold having a stationary mold part and a movable mold part paired to form a mold cavity. A molten material can be injected to fill the mold cavity. The molten material can then be cooled into a BMG article at a desired cooling rate. While injecting and/or cooling the molten material, the movement of the movable mold part can be controlled, such that a thermal contact between the molten material and the mold can be maintained. BMG articles can be formed without forming an underfilled part. Additional structural features can be imparted in the BMG article during formation. At least a portion of the formed BMG article can have an aspect ratio (first dimension/second dimension) of at least 10 or less than 0.1.

Abstract: Described herein is a method of selectively depositing molten bulk metallic glass (BMG). In one embodiment, a continuous stream or discrete droplets of molten BMG is deposited to selected positions. The deposition can be repeated as needed layer by layer. One or more layers of non-BMG can be used as needed.

Abstract: Systems and methods for positioning a component on a surface or substrate including the steps of applying a coating to a selected deposit area of the surface, each deposit area defining at least a portion of a perimeter of an alignment area, depositing an fluid on the coating, and depositing, dropping, or otherwise positioning the component above the alignment area are disclosed.

Abstract: Surfaces having structured optical appearances are disclosed. The surface can include substrate, a first optical coating disposed on the substrate having a first refractive index; and a second optical coating disposed on the first optical coating having a second refractive index. The first refractive index is different than the second refractive index. Other surfaces can include a substrate having a visible surface, wherein the visible surface comprises a plurality of structural features, wherein each of the structural features is configured to transmit a light wave that optically interacts with waves of light of other structural features to create a visual appearance. Still other surfaces can include a substrate and an optical coating disposed on the substrate. The optical coating comprising particles in an ordered array within a matrix, wherein the matrix has a first refractive index and the particles have a second refractive index.

Abstract: A method of modifying a substrate formed of non-deformable material is disclosed. In some embodiments, techniques are disclosed for identifying a region of a planar substrate that is susceptible to stretching during a subsequent shaping operation. In some embodiments, techniques are disclosed for adding an amount of non-deformable material to the planar substrate at an identified location and in a single operation, acting on the substrate until the substrate has a shape corresponding to a uniform thickness and a three-dimensional curvature.

Abstract: Provided in one embodiment is a method of forming a movable joint or connection between parts that move with respect to one another, wherein at least one part is at least partially enclosed by at least one second part. The method includes positioning an etchable material over an at least one first part, molding or forming an at least one second part over at least the etchable material, and removing the etchable material.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: Headset assemblies and headset connectors are provided. Headset connectors can include a magnetic mating face and a plurality of electrical contacts disposed within the mating face. Engaging assemblies and engaging connectors are also provided. The engaging connectors can include a housing having a mating side, a magnetic array structure, and a plurality of spring biased contact members. The magnetic array structure can be fixed within the housing and house a plurality of spring biased contact members. The spring biased contact members can include tips that extend out of the mating side. The tips can electrically couple with electrical contacts in a headset connector.

Abstract: A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.