Abstract: A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally formed within an integrated circuit (IC) is fabricated to form a monolithic IC device using silicon (or similar future semiconductors) fabrication techniques. The OHP is operable to transfer high local heat fluxes within the IC device to more accessible locations on the IC device for heat rejection to an available heat sink.

Abstract: A thermal management system for the at least one energy cell. The thermal management system includes a cold plate cell holder comprising at least one energy cell reservoir structured to retain the energy cell(s) and surround at least a first portion of a surface of the energy cell(s), and to thermally cool the energy cell(s). The system additionally includes a bus bar header to which one or more bus bar can be physically and thermally connected, and at least one oscillating heat pipe (OHP) cover disposable around a second portion of the surface of the energy cell(s). The OHP cover(s) is/are thermally and mechanically connectable to the cold plate cell holder when disposed around the energy cell(s). The OHP cover(s) is/are structured and operable to thermally cool the energy cell(s) via heat absorption from the second portion of the surface of the energy cell(s) when disposed around the energy cell(s).

Abstract: A thermal management system for the at least one energy cell. The thermal management system includes a cold plate cell holder comprising at least one energy cell reservoir structured to retain the energy cell(s) and surround at least a first portion of a surface of the energy cell(s), and to thermally cool the energy cell(s). The system additionally includes a bus bar header to which one or more bus bar can be physically and thermally connected, and at least one oscillating heat pipe (OHP) cover disposable around a second portion of the surface of the energy cell(s). The OHP cover(s) is/are thermally and mechanically connectable to the cold plate cell holder when disposed around the energy cell(s). The OHP cover(s) is/are structured and operable to thermally cool the energy cell(s) via heat absorption from the second portion of the surface of the energy cell(s) when disposed around the energy cell(s).

Abstract: A thermal management system for the at least one energy cell. The thermal management system includes a cold plate cell holder comprising at least one energy cell reservoir structured to retain the energy cell(s) and surround at least a first portion of a surface of the energy cell(s), and to thermally cool the energy cell(s). The system additionally includes a bus bar header to which one or more bus bar can be physically and thermally connected, and at least one oscillating heat pipe (OHP) cover disposable around a second portion of the surface of the energy cell(s). The OHP cover(s) is/are thermally and mechanically connectable to the cold plate cell holder when disposed around the energy cell(s). The OHP cover(s) is/are structured and operable to thermally cool the energy cell(s) via heat absorption from the second portion of the surface of the energy cell(s) when disposed around the energy cell(s).

Abstract: A thermal management system for the at least one energy cell. The thermal management system includes a cold plate cell holder comprising at least one energy cell reservoir structured to retain the energy cell(s) and surround at least a first portion of a surface of the energy cell(s), and to thermally cool the energy cell(s). The system additionally includes a bus bar header to which one or more bus bar can be physically and thermally connected, and at least one oscillating heat pipe (OHP) cover disposable around a second portion of the surface of the energy cell(s). The OHP cover(s) is/are thermally and mechanically connectable to the cold plate cell holder when disposed around the energy cell(s). The OHP cover(s) is/are structured and operable to thermally cool the energy cell(s) via heat absorption from the second portion of the surface of the energy cell(s) when disposed around the energy cell(s).

Abstract: A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally formed within an integrated circuit (IC) is fabricated to form a monolithic IC device using silicon (or similar future semiconductors) fabrication techniques. The OHP is operable to transfer high local heat fluxes within the IC device to more accessible locations on the IC device for heat rejection to an available heat sink.