Abstract: The present invention comprises the electrode assemblies themselves as well as improved plasma plate. The plasma side of the plate is counter bored in the area of the gas inlet holes to an appropriate depth. On the opposite side of the plate, another set of bores are placed around the outsides of the gas inlet feed throughs. These bores are machined to incorporate a set of metallic sleeves. The counter bore on the plasma side of the ceramic is used as the first step in removing the plasma from the ceramic surface. The metallic sleeves are utilized to prevent the plasma from invading the counter bore and touching the surface and to allow the surface to remain electrically uniform and planar to the substrate being etched. The sleeves create a negative charge close to the surface of the ceramic surface but not exposed to the plasma to create a dark space. The dark space mimics an electrically planar surface for the substrate while keeping the hot plasma from direct contact with the ceramic surface.