Patents by Inventor Christopher D. Wanha

Christopher D. Wanha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150079845
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 19, 2015
    Applicant: Molex Incorporated
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 8845364
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, or processor mounted on a circuit board to a backplane. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: September 30, 2014
    Assignee: Molex Incorporated
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan
  • Publication number: 20140242844
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, or processor mounted on a circuit board to a backplane. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: Molex Incorporated
    Inventors: Christopher D. WANHA, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan
  • Patent number: 5600881
    Abstract: A press apparatus is described for forcefully pressing a connector (14, FIG. 1) against a circuit board (12) to press projections (34) of the connector into circuit board holes (22), which minimizes set up time. The press includes a pair of platforms (60, 62, FIG. 2) on which a circuit board with a connector thereon is laid, an upper tooling arrangement (102) mounted on a ram, and a lower tooling arrangement (100) mounted on a stationary base (78). When the ram is lowered, it causes the circuit board and the connector thereon to move down against the lower tooling arrangement, and then seat the connector. The force of the ram is transmitted through the connector and circuit board to the lower tooling arrangement, so in many cases the stroke of the ram does not have to be adjusted for the thickness of the particular circuit board or connector.
    Type: Grant
    Filed: November 17, 1994
    Date of Patent: February 11, 1997
    Assignee: ITT Corporation
    Inventor: Christopher D. Wanha
  • Patent number: 5368802
    Abstract: A heat stake press apparatus is described for fixing a connecter to a circuit board by heat staking pegs of the connector, which facilitates alignment of the circuit board holes with forming tips in a low cost press. A pair of aligners (110, 112, FIG. 6 ) is provided that are each mounted at a forward edge of the board in alignment with a peg hole (22) of the board. The board is mounted on support guides (62, 64) of the press, and the board is slid forwardly until a pair of forming tips (52) are received in slots (124) of the aligners to sidewardly align the board. The support guides are then moved sidewardly so board guide pins (74A, 76A, FIG. 2 ) move against side edges (80, 82) of the board. Thereafter, the aligners are removed, a connector (14) is placed on the board with its pegs projecting down through the board holes, and the board is again placed in the press on the support guides.
    Type: Grant
    Filed: May 13, 1993
    Date of Patent: November 29, 1994
    Assignee: ITT Corporation
    Inventor: Christopher D. Wanha
  • Patent number: 4966538
    Abstract: Molding apparatus, particularly for mounting specimens for microstructural analysis. A ramhead pressurizes a molding chamber, with the pressure, temperature and time of the cycle being set into the system from a control panel and proceeding automatically. The ramhead is advanced through a hydraulic system. A spring is provided for mounting the tubular molding chamber to permit the molding chamber to spontaneously align with the advancing ramhead. A wrench member is provided as an integral part of the apparatus to rotationally lock the handle to the molding chamber, to permit rotation of the molding chamber through the handle for removal thereof when desired.
    Type: Grant
    Filed: June 1, 1988
    Date of Patent: October 30, 1990
    Assignee: Buehler, Ltd.
    Inventors: Thomas A. Linke, Troy W. Livingston, Christopher D. Wanha, Charles E. Shewey