Abstract: The invention provides for methods by which the economics of the gas fermentation process are improved. The invention provides for the integration of a fermentation process, with an industrial process and an electrolyzer process. The invention provides for the intermittent supply of electrolyzer feedstock from the electrolyzer process to the bioreactor for fermentation. The electrolyzer feedstock may displace at least a portion of the C1 feedstock from the industrial process. The electrolyzer feedstock may supplement the C1 feedstock from the industrial process. Whether or not the electrolyzer feedstock supplements or displaces the C1 feedstock with electrolyzer feedstock may be based upon a function of the cost per unit of the C1 feedstock, the cost per unit of the electrolyzer feedstock, and the value per unit of the fermentation product.

Abstract: A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

Abstract: Techniques are disclosed for systems and methods to provide waypoint sharing with respect to sonar imagery for mobile structures. A waypoint sharing system includes a portable electronic device with a display, a communications module, and a logic device configured to receive a waypoint database from a sonar system user interface or a waypoint server over a wireless communication link, receive user input to adjust at least a portion of the waypoint database, and provide the adjusted waypoint database to the sonar system user interface or the waypoint server over the wireless communication link. The sonar system user interface is configured to provide a waypoint database to the portable electronic device or the waypoint server over the wireless communication ink, receive the adjusted waypoint database from the device or the server over the wireless communication link, and render at least a portion of the adjusted waypoint database on a display.

Abstract: Apparatuses and methods for improving airway patency are provided. A medial surface of the patient's tongue is constrained with a tongue constraint of an oral device placed in the oral cavity to generate a clear region between the medial surface and the hard palate. The clear region is in fluid communication with the soft palate. The tongue constraint has superior surface and inferior surfaces configured to generate the clear region. Negative pressure is applied within the oral cavity to hold the soft palate in a position in which the airway is at least partially open. The negative pressure is applied through one or more ports of the oral device. The one or more ports remain unobstructed by the tongue when the negative pressure is applied. The applied negative pressure causes the soft palate and tongue form a seal whereby the patient's airway is substantially fluidly isolated from the clear region.

Abstract: A microelectronic device includes a reflow structure. The reflow structure has a copper-containing member and a solder member, and a barrier layer between them. The barrier layer has metal grains, with a diffusion barrier filler between the metal grains. The metal grains include at least a first metal and a second metal, each selected from nickel, cobalt, lanthanum, and cerium, with each having a concentration in the metal grains of at least 10 weight percent. The diffusion barrier filler includes at least a third metal, selected from tungsten and molybdenum. A combined concentration of tungsten and molybdenum in the diffusion barrier filler is higher than in the metal grains to provide a desired resistance to diffusion of copper. The barrier layer includes 2 weight percent to 15 weight percent of the combined concentration of tungsten, and molybdenum. A bump bond structure and a lead frame package are disclosed.

Abstract: The present disclosure is directed to a rotor blade component for a wind turbine. The rotor blade component includes a plurality of pre-cured members arranged in one or more layers. Each of the pre-cured members is constructed of a plurality of fiber materials cured together via a resin material having a first stiffness and at least additional material having a second stiffness. Further, the second stiffness is lower than the first stiffness. As such, the additional low-stiffness material is cured within the resin material so as to increase flexibility of the pre-cured members.

Abstract: The present subject matter is directed to a rotor blade assembly for a wind turbine having a pultruded component at an interface of a shear web and a spar cap. More specifically, the rotor blade assembly includes an upper shell member having an upper spar cap configured on an internal surface thereof and a lower shell member having a lower spar cap configured on an internal surface thereof. A shear web extends between the spar caps along a longitudinal length of the blade. Further, the shear web includes a first end and a second end. The first end is secured to the upper spar cap at a first interface and the second end is secured to the lower spar cap at a second interface. In addition, the shear web includes at least one pultruded component configured at either or both of the first or second interfaces between the first and second ends and the upper and lower spar caps, respectively.

Abstract: Subject matter disclosed herein may relate to systems, devices, and/or processes for processing signals and/or states representative of behavioral and/or biological state.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for generating a data entity that causes a processing unit to process a computational graph. In one aspect, a method includes the actions of receiving data identifying a computational graph, the computational graph including a plurality of nodes representing operations; obtaining compilation artifacts for processing the computational graph on a processing unit; and generating a data entity from the compilation artifacts, wherein the data entity, when invoked, causes the processing unit to process the computational graph by executing the operations represented by the plurality of nodes.

Abstract: Methods, systems, and apparatus, including a system for transforming sparse elements to a dense matrix. The system is configured to receive a request for an output matrix based on sparse elements including sparse elements associated with a first dense matrix and sparse elements associated with a second dense matrix; obtain the sparse elements associated with the first dense matrix fetched by a first group of sparse element access units; obtain the sparse elements associated with the second dense matrix fetched by a second group of sparse element access units; and transform the sparse elements associated with the first dense matrix and the sparse elements associated with the second dense matrix to generate the output dense matrix that includes the sparse elements associated with the first dense matrix and the sparse elements associated with the second dense matrix.

Abstract: A rotor blade for a wind turbine may generally include a first blade component formed from a first fiber-reinforced composite including a first thermoplastic resin material and a second blade component configured to be coupled to the first blade component at a joint interface. The second blade component may be formed from a second fiber-reinforced composite including a second thermoplastic resin material. The second fiber-reinforced composite may include a low fiber region and a high fiber region, with the low fiber region having a fiber-weight fraction that is less than a fiber-weight fraction of the high fiber region. In addition, the first thermoplastic resin material of the first fiber-reinforced composite may be welded to the second thermoplastic resin material contained within the low fiber region of the second thermoplastic composite to form a welded joint at the joint interface between the first blade component and the second blade component.

Abstract: A packaged semiconductor die includes a semiconductor die coupled to a die pad. The semiconductor die has a front side containing copper leads, a copper seed layer coupled to the copper leads, and a nickel alloy coating coupled to the copper seed layer. The nickel alloy includes tungsten and cerium (NiWCe). The packaged semiconductor die may also include wire bonds coupled between leads of a lead frame and the copper leads of the semiconductor die. In addition, the packaged semiconductor die may be encapsulated in molding compound. A method for fabricating a packaged semiconductor die. The method includes forming a copper seed layer over the copper leads of the semiconductor die. In addition, the method includes coating the copper seed layer with a nickel alloy. The method also includes singulating the semiconductor wafer to create individual semiconductor die and placing the semiconductor die onto a die pad of a lead frame.

Abstract: The invention provides schemes for the integration of a fermentation process, with an electrolysis process, and a C1-generating industrial process. In particular, the invention provides process for utilizing electrolysis products, for example H2 and/or O2, to improve the process efficiency of at least one of the fermentation process or the C1-generating industrial process. More particularly, the invention provides a process whereby, H2 generated by electrolysis is used to improve the substrate efficiency for a fermentation process, and the O2 generated by the electrolysis process is used to improve the composition of the C1-containing tail gas generated by the C1-generating industrial process.

Abstract: The present disclosure is directed to a pre-formed, continuous structural component for use in assembling a modular rotor blade for a wind turbine. Further, the structural component provides support to the modular rotor blade during operation. The pre-formed structural component includes a root portion and a body portion. The root portion is configured for mounting the structural component to a blade root section of the rotor blade. The body portion is configured to extend in a generally span-wise direction. Further, the body portion defines a predetermined cross-section having a flatback portion with a first end and a second end. In addition, the first and second ends each have a flange extending perpendicularly therefrom. Thus, each flange defines a mounting surface for one or more blade segments.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for generating a data entity that causes a processing unit to process a computational graph. In one aspect, method includes the actions of receiving data identifying a computational graph, the computational graph including a plurality of nodes representing operations; obtaining compilation artifacts for processing the computational graph on a processing unit; and generating a data entity from the compilation artifacts, wherein the data entity, when invoked, causes the processing unit to process the computational graph by executing the operations represented by the plurality of nodes.

Abstract: In one aspect, a method for manufacturing a spar cap for a wind turbine rotor blade may generally include stacking a plurality of plates together to form a plate assembly, wherein each of the plates is formed from a fiber-reinforced composite including a plurality of fibers surrounded by a thermoplastic resin material. The method may also include positioning the plate assembly relative to a mold defining a mold surface, wherein the mold surface is shaped so as to correspond to at least one blade parameter of the wind turbine rotor blade. In addition, the method may include applying pressure to the plate assembly via the mold such that at least a portion of the plate assembly conforms to the shape of the mold surface.