Abstract: The disclosure relates to a mirror device for an interferometer device including a first mirror layer and a second mirror layer, which are arranged in parallel on top of one another and spaced apart from one another by a mirror layer spacing. The mirror layer spacing forms an intermediate space between the first and the second mirror layer. The intermediate space includes a gas or a vacuum, and at least one spacing structure which extends at least partially between the first and the second mirror layer. The spacing structure has a material that is the same as or different from the first and/or second mirror layer.

Abstract: An integrated circuit (IC) includes a substrate including circuitry configured for a function, the circuitry including at least one stress sensitive circuit portion, with at least a portion of nodes in the circuitry electrically coupled to bond pads provided by a top metal layer. A metal wall that is ring-shaped is positioned above the top metal layer that is not electrically coupled to the circuitry. The stress sensitive circuit portion is with at least a majority of its area within an inner area of the substrate that is framed by the metal wall to provide a cavity.

Abstract: A dynamic Scalable Vector Graphics (SVG) system and associated methods are provided for rendering an interactive software-product demonstration presentation for an envisioned software product within a webpage. A script can be executed to digest an exported SVG file by: querying for target objects having particular attributes named in a target format, and/or particular tag names. For each of the target objects, methods are called to modify that target object based on a first found tag name, a first found attribute, and/or contents of the first found attribute. The called methods can be used to manipulate attributes and/or contents of that target object to modify it and generate a manipulated object that includes the outputs of each called method (e.g., appropriate contents to be inserted into the SVG file). The manipulated objects with the appropriate contents can then be inserted into the SVG file to generate a final SVG file.

Abstract: Embodiments of the present invention provide systems and methods for generation and maintenance of verified data records. The system may receive a data submission from a user device over one or more communication channels and convert the data submission into a normalized text format for processing and analysis. The data submission may then be analyzed using one or more trained machined learning models in order to identify factual statements and modifiers within the data submission, and generate a confidence score of verified factual information based on corroboration with one or more additional data sources. Additionally, identified modifiers may be analyzed to determine positive or negative sentiment.

Abstract: An apparatus for separating an analyte from a test sample, such as bacteria from blood components, based on their dielectric properties, localizing or condensing the analyte, flushing substantially all remaining waste products from the test sample, and detecting low concentrations of the analyte. The module array includes a plurality of microfluidic channels with connecting microfluidic waste channels for directing undesired material away from the analyte.

Abstract: Embodiments of the invention are directed to a system that performs virtual private network authentication with a read only sandbox integration for virtual private network security. In this way, the invention matches an internet protocol address to a user portrait of user internet protocol addresses to confirm that the connecting device is the authentic user for accessing the virtual private network. If there is a discrepancy between the user portrait and the internet protocol address of the connecting device, the system launches a read only sandbox for connecting device interaction. The read only sandbox allows for bilateral communication with the connecting device where the system has full access to the connection device at a file level to interrogate file level data for confirmation.

Abstract: In some examples, a chip scale package (CSP) comprises a semiconductor die; a passivation layer abutting the semiconductor die; a via extending through the passivation layer; and a first metal layer abutting the via. The CSP also includes an insulation layer abutting the first metal layer, with the insulation layer having an orifice with a maximal horizontal area of less than 32400 microns2. The CSP further includes a second metal layer abutting the insulation layer and adapted to couple to a solder ball. The second metal layer abuts the first metal layer at a point of contact defined by the orifice in the insulation layer.

Abstract: An automatic tattoo apparatus can be used to robotically apply tattoos. A customer can shop on an online tattoo marketplace to select designs created by various artists located anywhere. The online tattoo marketplace can process and manage payments, artist and/or customer profiles, bookings, tattoo design uploads, browsing and design selection, design changes, and/or perform other actions. The automatic tattoo device can apply tattoos precisely, quickly, and may with reduced pain. The tattoo apparatus can apply a wide range of different types of tattoos, including but not limited to micro tattoos, dotwork, blackwork tattoos, realism tattoos, fine-line tattoos, etc.

Abstract: An air handling unit (AHU) for a heating, ventilation, air conditioning, and refrigeration (HVACR) system includes a housing and a combustion heater disposed within the housing. The housing includes a combustion section with a first channel and a second channel. The combustion heater includes heat exchanger tubes and a tube support that supports heat exchanger tubes within the combustion section. The tube support slidably disposed in the first channel and the second channel. The combustion heater configured to be slidably removable from the AHU. An AHU for an HVACR system includes a housing with a fan section and a fan assembly disposed within the housing. The fan assembly including a pair of grooves slidably disposed on a pair of rails of the housing. The fan assembly configured to be both slidably removable from the AHU and liftably removable from the AHU.

Abstract: In a described example, an apparatus includes: a package substrate having a die mount portion and lead portions; at least one semiconductor device die over the die mount portion of the package substrate, the semiconductor device die having bond pads on an active surface facing away from the package substrate; electrical connections between at least one of the bond pads and one of the lead portions; a post interconnect over at least one of the bond pads, the post interconnect extending away from the active surface of the semiconductor device die; and a dielectric material covering a portion of the package substrate, the semiconductor device die, a portion of the post interconnect, and the electrical connections, forming a packaged semiconductor device, wherein the post interconnect extends through the dielectric material and had an end facing away from the semiconductor device die that is exposed from the dielectric material.

Abstract: Methods, systems, and apparatus, including a system for transforming sparse elements to a dense matrix. The system is configured to receive a request for an output matrix based on sparse elements including sparse elements associated with a first dense matrix and sparse elements associated with a second dense matrix; obtain the sparse elements associated with the first dense matrix fetched by a first group of sparse element access units; obtain the sparse elements associated with the second dense matrix fetched by a second group of sparse element access units; and transform the sparse elements associated with the first dense matrix and the sparse elements associated with the second dense matrix to generate the output dense matrix that includes the sparse elements associated with the first dense matrix and the sparse elements associated with the second dense matrix.

Abstract: In one illustrative configuration, an air quality monitoring system may enable wide-scale deployment of multiple air quality monitors with high-confidence and actionable data is provided. Further, the air quality monitoring system may enable identifying a target emission from a plurality of potential sources at a site based on simulating plume models. The simulation of plume models may take into consideration various simulation parameters including wind speed and direction. Further, methods of determining a plume flux of a plume of emissions at a site, and methods of transmitting data from an air quality monitor are disclosed.

Abstract: Embodiments of the invention are directed to a system that performs virtual private network authentication with a read only sandbox integration for virtual private network security. In this way, the invention matches an internet protocol address to a user portrait of user internet protocol addresses to confirm that the connecting device is the authentic user for accessing the virtual private network. If there is a discrepancy between the user portrait and the internet protocol address of the connecting device, the system launches a read only sandbox for connecting device interaction. The read only sandbox allows for bilateral communication with the connecting device where the system has full access to the connection device at a file level to interrogate file level data for confirmation.

Abstract: A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.

Abstract: A semiconductor package includes an IC having circuitry configured for at least one function with some nodes connected to bond pads, with first metal posts on the bond pads, and dome support metal posts configured in a ring having a top rim defining an inner cavity with solder on the top rim and extending over an area of the inner cavity for providing a solder dome that covers the inner cavity to provide a covered air cavity over a portion of the circuitry. A leadframe includes a plurality of leads or lead terminals. The IC is flipchip attached with a solder connection to the leadframe so that the first metal posts are attached to the leads or the lead terminals. A mold compound provides encapsulation for the semiconductor package except on at least a bottom side of the leads or lead terminals.

Abstract: A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1<a2. The first Ni alloy layer is between the Cu layer and the second Ni alloy layer. The structure further includes a tin (Sn) layer. The second Ni alloy layer is between the first Ni alloy layer and the Sn layer.

Abstract: A dental cleaning appliance includes a fluid reservoir for storing working fluid, a nozzle for delivering working fluid to the teeth of a user, a light source for illuminating the fluid reservoir and a control circuit for activating the light source to generate an alert which is conveyed to the user through the illumination of the fluid reservoir.

Abstract: In an illustrative configuration, a method for monitoring air quality is disclosed. The method includes accepting analyte gas into a cell and reflecting light rays into the analyte gas repeatedly across the cell into at least one sensor. The light scattered by particulate matter in the analyte gas and amount of spectra-absorption due to presence of a gaseous chemical is then measured. Based on the determined amount of spectra-absorption and the measured scattered light the gaseous chemical is then measured.

Abstract: An interferometer device includes an interferometer unit with at least two mirrors disposed in parallel, wherein at least one of the mirrors is actuatable parallel to the other mirror and a first distance between the two mirrors is alterable. The interferometer device further includes at least one deflection mirror disposed downstream of the interferometer unit in a light transmission direction of light from the interferometer unit and a detector device, onto which the light is able to be aligned by the deflection mirror. The detector device includes at least two differently sensitive detection regions for transmitted wavelengths or wavelength ranges of the light, which detection regions are spatially separated from one another and able to be irradiated separately by the deflection mirror.

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.