Patents by Inventor Christopher David BOHN

Christopher David BOHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High aspect ratio vias filled with liquid metal fill
    Patent number: 12336112
    Abstract: A substrate includes a substrate body made of a material such as glass, and at least one electrical via that extends at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: June 17, 2025
    Assignee: SAMTEC, INC.
    Inventors: Christopher David Bohn, Mark Crain, Justin Roehm, Thomas Jacob Hammann, Nathan Robertson, Jeremy Brown, Christopher Pelkey, Adam Owens, Russell Payton, Russell Frank
  • HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
    Publication number: 20240196540
    Abstract: A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.
    Type: Application
    Filed: April 11, 2022
    Publication date: June 13, 2024
    Inventors: Christopher David BOHN, Mark CRAIN, Justin ROEHM, Thomas Jacob HAMMANN, Nathan ROBERTSON, Jeremy BROWN, Christopher PELKEY, Adam OWENS, Russell PAYTON, Russell FRANK