Patents by Inventor Christopher Day States

Christopher Day States has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for providing electromagnetic shielding
    Patent number: 6490173
    Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: December 3, 2002
    Assignee: Thomson Licensing, S.A.
    Inventors: Russell Wayne Perkins, Mark Alan Yoder, Christopher Day States, Theodore Paul Corbin
  • Method and apparatus for providing electromagnetic shielding
    Publication number: 20020075664
    Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 20, 2002
    Inventors: Russell Wayne Perkins, Mark Alan Yoder, Christopher Day States, Theodore Paul Corbin