Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

Abstract: In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (Sq) of the interface between the polymer film and the first metal layer is less than 1 ?m. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 ?m and a first metal layer having a thickness of 18 ?m in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 ?m or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.

Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay and a second polyimide coverlay derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine or 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply having a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer, a fourth imaged metal layer.

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine. An adhesive layer is not present between the first imaged metal layer and the first polyimide coverlay.

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.

Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer and a fourth imaged metal layer.

Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.

Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.

Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, and 100 mole % 2,2?-bis(trifluoromethyl)benzidine. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.

Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl)benzidine. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.

Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.

Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.

Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.

Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.

Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.