Patents by Inventor Christopher Dennis Simone

Christopher Dennis Simone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210310126
    Abstract: In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (Sq) of the interface between the polymer film and the first metal layer is less than 1 ?m. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 ?m and a first metal layer having a thickness of 18 ?m in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 ?m or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.
    Type: Application
    Filed: April 3, 2020
    Publication date: October 7, 2021
    Inventors: Husnu Alp Alidedeoglu, Patricia Gumbley, Cecilia Hall, Joseph Casey Johnson, Benjamin Naab, Jaclyn Murphy, Grzegorz Slawinski, Christopher Dennis Simone
  • Publication number: 20200396833
    Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 17, 2020
    Inventors: JOSEPH CASEY JOHNSON, DELANIE J LOSEY, PEGGY SCOTT, CHRISTOPHER DENNIS SIMONE
  • Patent number: 9596757
    Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: March 14, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: G. Sidney Cox, Christopher Dennis Simone, Carl Robert Haeger
  • Patent number: 9585249
    Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: February 28, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Sidney G. Cox, Christopher Dennis Simone, Carl Robert Haeger, Richard A. Wessel
  • Publication number: 20150361264
    Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.
    Type: Application
    Filed: June 12, 2014
    Publication date: December 17, 2015
    Inventors: CHRISTOPHER DENNIS SIMONE, THOMAS EDWARD CARNEY
  • Publication number: 20150359092
    Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline.
    Type: Application
    Filed: June 21, 2013
    Publication date: December 10, 2015
    Inventors: Sidney G. Cox, Christopher Dennis Simone, Carl Robert Haeger, Richard A. Wessel
  • Publication number: 20150342044
    Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay and a second polyimide coverlay derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine or 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply having a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer, a fourth imaged metal layer.
    Type: Application
    Filed: June 21, 2013
    Publication date: November 26, 2015
    Inventors: Christopher Dennis Simone, Sidney G. Cox, Carl Robert Haeger, Richard A. Wessel
  • Publication number: 20150342041
    Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer and a fourth imaged metal layer.
    Type: Application
    Filed: June 21, 2013
    Publication date: November 26, 2015
    Inventors: Christopher Dennis Simone, Sidney G. Cox, Carl Robert Haeger
  • Publication number: 20150342043
    Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine. An adhesive layer is not present between the first imaged metal layer and the first polyimide coverlay.
    Type: Application
    Filed: June 21, 2013
    Publication date: November 26, 2015
    Inventors: Christopher Dennis Simone, Sidney G. Cox, Carl Robert Haeger, Richard A. Wessel
  • Publication number: 20150342042
    Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.
    Type: Application
    Filed: June 21, 2013
    Publication date: November 26, 2015
    Inventors: Sidney G. Cox, Christopher Dennis Simone, Carl Robert Haeger, Richard A. Wessel
  • Publication number: 20150336354
    Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.
    Type: Application
    Filed: June 21, 2013
    Publication date: November 26, 2015
    Inventors: Sidney G. Cox, Christopher Dennis Simone
  • Publication number: 20150201490
    Abstract: The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.
    Type: Application
    Filed: June 21, 2013
    Publication date: July 16, 2015
    Inventors: G. Sidney Cox, Christopher Dennis Simone, Carl Robert Haeger
  • Publication number: 20150197073
    Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, and 100 mole % 2,2?-bis(trifluoromethyl)benzidine. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.
    Type: Application
    Filed: June 21, 2013
    Publication date: July 16, 2015
    Inventors: G Sidney Cox, Christopher Dennis Simone, Carl Robert Haeger
  • Publication number: 20150147567
    Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl)benzidine. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.
    Type: Application
    Filed: June 21, 2013
    Publication date: May 28, 2015
    Inventors: Christopher Dennis Simone, Sidney G. Cox
  • Patent number: 8969909
    Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: March 3, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventors: Christopher Dennis Simone, Thomas Edward Carney
  • Patent number: 8853723
    Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: October 7, 2014
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Christopher Dennis Simone, Thomas Edward Carney
  • Publication number: 20130126940
    Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.
    Type: Application
    Filed: June 1, 2011
    Publication date: May 23, 2013
    Applicant: E I DU PONT DE NEMOURS and COMPANY
    Inventors: Christopher Dennis Simone, Thomas Edward Carney
  • Publication number: 20120049220
    Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.
    Type: Application
    Filed: June 1, 2011
    Publication date: March 1, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventor: CHRISTOPHER DENNIS SIMONE
  • Publication number: 20110039085
    Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.
    Type: Application
    Filed: August 5, 2010
    Publication date: February 17, 2011
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Thomas Edward Carney, Christopher Dennis Simone
  • Patent number: 7691471
    Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: April 6, 2010
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Jiang Ding, Christian Peter Lenges, Christopher Dennis Simone, Brian C. Auman