Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

Abstract: An apparatus and system, including a switch; and a set of tiles; wherein each of the set of tiles include a PIC die, a DSP die, a driver die, and a TIA die and methods thereto.

Abstract: A method, apparatus, and system for imaging a scene by flood illuminating the scene with a wavelength sweeping laser.

Abstract: A method, apparatus, and system for adjusting the phase noise of a laser.

Abstract: A method for steering a beam is disclosed. According to the method, a scene is scanned with a surface emitting grating optically coupled to a free propagation region. The free propagation region is optically coupled to waveguides. The waveguides are disposed at different angles to the surface emitting grating. The scanning includes scanning in a first dimension by cycling through a cross connect to illuminate each waveguide of the waveguides. Scanning in a second dimension is performed by tuning a wavelength of light used to illuminate the waveguides.

Abstract: A system including an optical transceiver, including a first portion of a laser cavity operable to output optical energy; and an optical modulator operable to modulate the optical energy output by the laser; and a temperature-controlled optical gain subassembly optically coupled to the optical transceiver, the optical gain subassembly including a plurality of semiconductor optical amplifiers (SOAs), wherein one SOA of the plurality of SOAs is operable to amplify the optical energy inside a laser cavity.

Abstract: A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.

Abstract: A system and method of measuring a temperature including applying a first set of voltages across a circuit in sequence; detecting a second set of voltages corresponding to the first set of voltages, wherein the second set of voltages includes a first detected voltage, a second detected voltage, and a third detected voltage, wherein the first applied voltage corresponds to the first detected voltage, the second applied voltage corresponds to the second detected voltage, and a third applied voltage corresponds to the third detected voltage; modifying an output of a heater proximate to the diode within the circuit, wherein a combined heat dissipation of the heater and the diode remains constant during operation of the circuit; and determining a temperature proximate to the diode based on the first set of voltages and the second set of voltages.

Abstract: A method, apparatus, and system for an external cavity laser with a Michelson Interferometer.

Abstract: A system including an optical transceiver, including a first portion of a laser cavity operable to output optical energy; and an optical modulator operable to modulate the optical energy output by the laser; and a temperature-controlled optical gain subassembly optically coupled to the optical transceiver, the optical gain subassembly including a plurality of semiconductor optical amplifiers (SOAs), wherein one SOA of the plurality of SOAs is operable to amplify the optical energy inside a laser cavity.

Abstract: An optical system may include a scanning element, a detector, and a planar lightwave circuit (PLC)-based walk-off compensator. The PLC-based walk-off compensator may include a plurality of input waveguides associated with receiving an optical signal from the scanning element. The PLC-based walk-off compensator may include an optical switch configured to select one or more input waveguides, from the plurality of input waveguides, to be coupled to the detector. The selection of the one or more input waveguides may be based on an expected walk-off of the optical signal. The PLC-based walk-off compensator may include an output waveguide to provide the optical signal to the detector.

Abstract: An apparatus and method for calculating the frequency of the light.

Abstract: An integrated wavelength division multiplexer is described. The integrated wavelength division multiplexer may include a first waveguide core defining a first propagation axis and configured to guide light of a first wavelength and light of a second wavelength, and a second waveguide core defining a second propagation axis and configured to guide the light of the second wavelength. A first portion of the second propagation axis for which the first waveguide core and second waveguide core may be overlapping is oriented at a non-zero angle relative to the first propagation axis. The first waveguide core and second waveguide core may be configured relative to each other to adiabatically couple the light of the second wavelength between the first and second waveguide cores.

Abstract: A method and apparatus for scanning a scene.

Abstract: An apparatus and system, including a switch; and a set of tiles; wherein each of the set of tiles include a PIC die, a DSP die, a driver die, and a TIA die and methods thereto.

Abstract: In a first embodiment, an external cavity tunable laser, comprising a silicon photonics circuit comprising one or more resonators having one or more p-i-n junctions; wherein a voltage is applied to one or more of the p-i-n junctions. In a second embodiment, a method of operating an external cavity tunable laser, comprising sweeping out free-carriers from a resonator of the tunable laser by applying a voltage to a p-i-n junction of a waveguide of the resonator.

Abstract: Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

Abstract: An optical coherent transceiver comprising a polarization and phase-diversity coherent receiver and a polarization and phase-diversity modulator on the same substrate interfaced by three grating couplers, one grating coupler coupling in a signal, one grating coupler coupling in a laser signal, and a third grating coupler coupling out a modulated signal.

Abstract: A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity N×M coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the N×M coupler and the optical amplifiers can be used to adjust an amount of power output from M?1 ports of the N×M coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.

Abstract: Disclosed herein are techniques, methods, structures and apparatus that provide a silicon photonics multicarrier optical transceiver wherein both the transmitter and receiver are integrated on a single silicon chip and which generates a plurality of carriers through the effect of an on-chip modulator, amplifies the optical power of the carriers through the effect of an off-chip amplifier, and generates M orthogonal sets of carriers through the effect of an on-chip basis former.