Patents by Inventor Christopher E. Mosher

Christopher E. Mosher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame based ceramic air cavity package
    Patent number: 8242588
    Abstract: A ceramic semiconductor package provides for being surface mounted on a printed circuit board or other mounting surface. A ceramic frame is directly attached to a lead frame to define a cavity in which the base of a semiconductor device is mounted to the portion of the lead frame exposed at the bottom of the cavity. Interface terminals of the semiconductor device are attached to electrical contacts on the ceramic frame inside the cavity. The ceramic package provides a hermetic insulated path through which the signals can be routed from the device to the external leads. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.e., heat dissipation, is more effectively provided by this direct connection without intervening layers of ceramic or conductor.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: August 14, 2012
    Assignees: Barry Industries, Inc., Semiconductor Enclosures, Inc.
    Inventors: Christopher E. Mosher, Ronald H. Schmidt
  • LEAD FRAME BASED CERAMIC AIR CAVITY PACKAGE
    Publication number: 20110012242
    Abstract: A ceramic semiconductor package provides for being surface mounted on a printed circuit board or other mounting surface. A ceramic frame is directly attached to a lead frame to define a cavity in which the base of a semiconductor device is mounted to the portion of the lead frame exposed at the bottom of the cavity. Interface terminals of the semiconductor device are attached to electrical contacts on the ceramic frame inside the cavity. The ceramic package provides a hermetic insulated path through which the signals can be routed from the device to the external leads. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.e., heat dissipation, is more effectively provided by this direct connection without intervening layers of ceramic or conductor.
    Type: Application
    Filed: July 19, 2010
    Publication date: January 20, 2011
    Inventors: Christopher E. Mosher, Ronald H. Schmidt