Patents by Inventor Christopher E. Sosh

Christopher E. Sosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component package
    Patent number: 7224076
    Abstract: An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: May 29, 2007
    Assignee: Agere Systems Inc
    Inventors: Gaurav Agrawal, Jesse W. Booker, Christopher E. Sosh
  • Electronic component package
    Patent number: 6881613
    Abstract: An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: April 19, 2005
    Assignee: Agere Systems Inc
    Inventors: Gaurav Agrawal, Jesse W. Booker, Christopher E. Sosh
  • Electronic component package
    Publication number: 20040065950
    Abstract: An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
    Type: Application
    Filed: October 8, 2002
    Publication date: April 8, 2004
    Inventors: Gaurav Agrawal, Jesse W. Booker, Christopher E. Sosh