Abstract: A seal board includes a circuit board with vias, conductor pins, and solder joints. The solder joints connect and seal each conductor pin to a single via, such that each conductor pin extends through the via and extends from a first side of the circuit board and a second side of the circuit board. The seal board is mounted to cover an opening in a bulkhead that separates a first compartment (such as a terminal block compartment) from a second compartment (such as an electronics or feature board compartment). The seal board provides electrical paths between the compartments while protecting components within one of the compartments from the surrounding environment.

Abstract: A seal board includes a circuit board with vias, conductor pins, and solder joints. The solder joints connect and seal each conductor pin to a single via, such that each conductor pin extends through the via and extends from a first side of the circuit board and a second side of the circuit board. The seal board is mounted to cover an opening in a bulkhead that separates a first compartment (such as a terminal block compartment) from a second compartment (such as an electronics or feature board compartment). The seal board provides electrical paths between the compartments while protecting components within one of the compartments from the surrounding environment.

Abstract: A pressure transducer for clean environments is disclosed. The pressure transducer includes a process coupler, a sensor module, a shield and electronics. The process coupler is configured to couple to a source of process media at a process inlet. The sensor module is coupled to the process coupler and has a pressure sensor therein. The pressure sensor has an electrical characteristic that varies in response to pressure within the sensor module. The shield is disposed adjacent to the process coupler and configured to obstruct substantially all lines of sight between the process inlet and the pressure sensor. Electronics within the transducer are coupled to the pressure sensor to measure the electrical characteristic and provide an indication thereof. A method of sensing a pressure in a clean environment is also provided.

Abstract: A grip for holding soft materials is described wherein the gripping surface of the grip is cooled by a thermo-electric cooler. The grip of the present invention includes grip members having opposed gripping surfaces that contact the soft material. The grip does not require use of cryogenic materials and is suitable for use in contact with fluids at body temperature. The temperature of the grip can be easily controlled.