Abstract: Embodiments herein may relate to a substrate that includes a coaxial via with a signal portion and a ground shield portion. In embodiments, the via may further include a pad that is coupled with the signal portion. The pad and the ground shield portion may not be coplanar with one another. In embodiments, the substrate may have a plurality of vias that may be formed in a staged and/or skipped manner. Other embodiments may be described and/or claimed.