Abstract: In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.

Abstract: In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.