Abstract: Various data capture assemblies and methods are provided. In one embodiment, a data capture assembly is provided that includes a bolster plate with an aperture attached to a multi-chip module. A pad array is disposed on the multi-chip module and is exposed through the aperture. An interposer is electrically coupled to the pad array on the multi-chip module, and a translator board is electrically coupled to the interposer. A logical analyzer interface is electrically coupled to the translator board.