Patents by Inventor Christopher G. Clark, Jr.

Christopher G. Clark, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SMA resin formulation
    Patent number: 11891475
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: February 6, 2024
    Assignee: Isola USA Corp.
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
  • SMA Resin Formulation
    Publication number: 20230141772
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Application
    Filed: June 21, 2022
    Publication date: May 11, 2023
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, JR.
  • SMA resin formulation
    Patent number: 11365282
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: June 21, 2022
    Assignee: Isola USA Corp.
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
  • Improved SMA Resin Formulation
    Publication number: 20190270873
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Application
    Filed: July 25, 2017
    Publication date: September 5, 2019
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.