Abstract: The system can include and the method can provide a first printed circuit board antenna tile. The first printed circuit board antenna tile comprises a repeating pattern of antenna element units. The antenna can also include and the method can also provide a second first printed circuit board antenna tile comprising the repeating pattern. The first printed circuit board antenna tile and the second first printed circuit board antenna tile can be attached such that the antenna elements maintain the same spacing in an X-Y plane associated with the repeating pattern across a boundary the first printed circuit board antenna tile and the second first printed circuit board antenna tile.

Abstract: An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.

Abstract: An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.

Abstract: The system can include and the method can provide a first printed circuit board antenna tile. The first printed circuit board antenna tile comprises a repeating pattern of antenna element units. The antenna can also include and the method can also provide a second first printed circuit board antenna tile comprising the repeating pattern. The first printed circuit board antenna tile and the second first printed circuit board antenna tile can be attached such that the antenna elements maintain the same spacing in an X-Y plane associated with the repeating pattern across a boundary the first printed circuit board antenna tile and the second first printed circuit board antenna tile.

Abstract: The system can include and the method can provide a first printed circuit board antenna tile. The first printed circuit board antenna tile comprises a repeating pattern of antenna element units. The antenna can also include and the method can also provide a second first printed circuit board antenna tile comprising the repeating pattern. The first printed circuit board antenna tile and the second first printed circuit board antenna tile can be attached such that the antenna elements maintain the same spacing in an X-Y plane associated with the repeating pattern across a boundary the first printed circuit board antenna tile and the second first printed circuit board antenna tile.

Abstract: The system can include and the method can provide a first printed circuit board antenna tile. The first printed circuit board antenna tile comprises a repeating pattern of antenna element units. The antenna can also include and the method can also provide a second first printed circuit board antenna tile comprising the repeating pattern. The first printed circuit board antenna tile and the second first printed circuit board antenna tile can be attached such that the antenna elements maintain the same spacing in an X-Y plane associated with the repeating pattern across a boundary the first printed circuit board antenna tile and the second first printed circuit board antenna tile.

Abstract: An electronically scanned array radiating element includes a ground plane layer having a pair of conductive probes. A metallization layer is coupled with the ground plane layer and includes a first asymmetric cluster including HOF scattering members and impedance-matching dipoles. A first electrically-large impedance-matching dipole is coupled with one of the conductive probes and is associated with the first asymmetric cluster. The first electrically-large impedance-matching dipole and the first asymmetric cluster may cooperate with one another to produce a signal. A second asymmetric cluster includes HOF scattering members and impedance-matching dipoles. A second electrically-large impedance-matching dipole is coupled with the other conductive probe and is associated with the second asymmetric cluster. The electrically-large impedance-matching dipole and the asymmetric cluster may cooperate with one another to produce a second signal having a polarization orthogonal to the polarization of the first signal.

Abstract: An integrated circuit chip and method of manufacturing the same which includes the use of a wafer cap having depressions therein for aligning with micro-electro-mechanical systems included in said integrated circuit when said cap is placed over a wafer containing numerous integrated circuits, the wafer is then cut, after the wafer cap is bound to the wafer. The wafer cap may also include a piezo-resistive element thereon for measuring pressure around the hermetically sealed MEMS.

Abstract: An integrated circuit chip and method of manufacturing the same which includes the use of a wafer cap having depressions therein for aligning with micro-electro-mechanical systems included in said integrated circuit when said cap is placed over a wafer containing numerous integrated circuits, the wafer is then cut, after the wafer cap is bound to the wafer. The wafer cap may also include a piezo-resistive element thereon for measuring pressure around the hermetically sealed MEMS.