Patents by Inventor Christopher G. Talbot

Christopher G. Talbot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10421125
    Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system including an energy source to generate an energy beam having an adjustable intensity profile, an actuator to cause the energy beam to traverse across an outermost layer of feed material, and a controller coupled to the actuator and the energy source. The controller is configured to cause the energy source to adjust the intensity profile of the energy beam on the outermost layer of feed material based on a traversal velocity and/or a traversal direction of the light beam across the outermost layer of feed material.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 24, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Hou T. Ng, Ron Naftali, Christopher G. Talbot
  • Patent number: 10307822
    Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system to direct an energy beam to fuse at least a portion of the outermost layer of feed material. The fusing system includes an energy source to emit the energy beam, a deformable mirror to receive the energy beam and reflect the energy beam, wherein a shape of the deformable mirror defines at least in part an intensity profile of the energy beam on the outermost layer of feed material, an actuator coupled to the deformable mirror, and a controller coupled to the actuator and configured to cause the actuator to deform the shape of the deformable mirror to adjust the intensity profile of the energy beam on the outermost layer of feed material in accordance to a desired profile.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: June 4, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Hou T. Ng, Ron Naftali, Christopher G. Talbot
  • Patent number: 9915621
    Abstract: An extreme ultraviolet (EUV) substrate inspection system and method of manufacturing thereof, includes: an EUV source directing EUV illumination through an aperture; a light detector detecting mask illumination with reduced off axis rays reflected off from a substrate; and a computing device processing image data detected by the light detector.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: March 13, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Majeed A. Foad, Christopher Dennis Bencher, Christopher G. Talbot, John Christopher Moran
  • Publication number: 20180029127
    Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system including an energy source to generate an energy beam having an adjustable intensity profile, an actuator to cause the energy beam to traverse across an outermost layer of feed material, and a controller coupled to the actuator and the energy source. The controller is configured to cause the energy source to adjust the intensity profile of the energy beam on the outermost layer of feed material based on a traversal velocity and/or a traversal direction of the light beam across the outermost layer of feed material.
    Type: Application
    Filed: July 20, 2017
    Publication date: February 1, 2018
    Inventors: Hou T. Ng, Ron Naftali, Christopher G. Talbot
  • Publication number: 20180029126
    Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system to direct an energy beam to fuse at least a portion of the outermost layer of feed material. The fusing system includes an energy source to emit the energy beam, a deformable mirror to receive the energy beam and reflect the energy beam, wherein a shape of the deformable mirror defines at least in part an intensity profile of the energy beam on the outermost layer of feed material, an actuator coupled to the deformable mirror, and a controller coupled to the actuator and configured to cause the actuator to deform the shape of the deformable mirror to adjust the intensity profile of the energy beam on the outermost layer of feed material in accordance to a desired profile.
    Type: Application
    Filed: July 20, 2017
    Publication date: February 1, 2018
    Inventors: Hou T. Ng, Ron Naftali, Christopher G. Talbot
  • Publication number: 20160282280
    Abstract: An extreme ultraviolet (EUV) substrate inspection system and method of manufacturing thereof, includes: an EUV source directing EUV illumination through an aperture; a light detector detecting mask illumination with reduced off axis rays reflected off from a substrate; and a computing device processing image data detected by the light detector.
    Type: Application
    Filed: December 18, 2014
    Publication date: September 29, 2016
    Inventors: Majeed A. Foad, Christopher Dennis Bencher, Christopher G. Talbot, John Christopher Moran
  • Patent number: 7253645
    Abstract: A method of detecting defects in a patterned substrate includes positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: August 7, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Christopher G. Talbot, Chiwoei Wayne Lo
  • Patent number: 6914441
    Abstract: One embodiment of the present invention is a method of detecting defects in a patterned substrate, including: (a) positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; (b) operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and (c) comparing the acquired images to a reference to identify defects in the patterned substrate.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: July 5, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Christopher G. Talbot, Chiwoei Wayne Lo
  • Patent number: 6539106
    Abstract: Methods and apparatus are provided for inspecting a patterned substrate, comprising: preparing a reference image and a test image, extracting features from the reference image and extracting features from the test image, matching features of the reference image and features of the test image; and comparing features of the reference image and of the test image to identify defects. Embodiments include apparatus for inspecting patterned substrates, computer-readable media containing instructions for controlling a system having a processor for inspecting patterned substrates, and computer program products comprising a computer usable media having computer-readable program code embodied therein for controlling a system for inspecting patterned substrates. The images can be electron-beam voltage-contrast images.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: March 25, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Harry S. Gallarda, Chiwoei Wayne Lo, Adam Rhoads, Christopher G. Talbot
  • Patent number: 6509750
    Abstract: Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large-FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: January 21, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Christopher G. Talbot, Chiwoei Wayne Lo
  • Publication number: 20020166964
    Abstract: Abstract of the Disclosure One embodiment of the present invention is a method of detecting defects in a patterned substrate, including: (a) positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV;. (b) operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and (c) comparing the acquired images to a reference to identify defects in the patterned substrate.
    Type: Application
    Filed: April 29, 2002
    Publication date: November 14, 2002
    Inventors: Christopher G. Talbot, Chiwoei Wayne Lo
  • Patent number: 6252412
    Abstract: Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large- FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: June 26, 2001
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher G. Talbot, Chiwoei Wayne Lo
  • Patent number: 5616921
    Abstract: Preferential etching during FIB milling can result in a rough, pitted surface and make IC probing/repair operations difficult. Preferential etching is compensated by acquiring a contrast image of the partially-milled sample, preparing mask image data from the contrast image, and controlling further FIB milling using the mask image data. For example, a window is to be milled in a top-layer power plane of an IC to expose a hidden layer. The window is partially milled. A FIB image is acquired and thresholded to produce mask image data. The mask image data distinguish areas where the power plane has been milled through from those where it has not been milled through. Milling is resumed using the mask image data to control effective FIB milling current. The mask image data are updated periodically as the window is milled.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: April 1, 1997
    Assignee: Schlumberger Technologies Inc.
    Inventors: Christopher G. Talbot, Douglas Masnaghetti, Hongyu Ximen
  • Patent number: 5530372
    Abstract: Probe-point placement methods are described. A layout description, a netlist description and a cross-reference description of an IC are retrieved from storage. The data structures associate with each net name a list of polygons. Polygons of a selected net are broken into segments of a specified step size. Each segment is evaluated in accordance with a set of prober rules. Values produced by the prober rules are weighted and combined to obtain a prober score for each segment. The prober score indicates suitability of the corresponding net location for probing. If the best prober score indicates an optimal segment exists for probing, the coordinates of that segment are stored and used to direct a probe to the corresponding location of the IC. If the best prober score indicates no optimal segment exists for probing, each segment of the net is evaluated in accordance with a set of probe-point cutter rules.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: June 25, 1996
    Assignee: Schlumberger Technologies, Inc.
    Inventors: William T. Lee, Ronny Soetarman, Christopher G. Talbot
  • Patent number: 5401972
    Abstract: Focused ion bean (FIB) milling through a power plane of a device to expose or cut a hidden, lower-layer conductor requires accurate positioning relative to the hidden conductor of a box defining boundaries of the FIB operation. This can in general be done by aligning surface information (topology or voltage contrast) visible in a FIB or scanning electron microscope (SEM) image with an overlay image generated from stored data describing the device. The location of the hidden conductor relative to the visible surface information is determined from the stored data. Advanced integrated circuits often do not provide enough unique surface information near the FIB operation area to align the images with sufficient accuracy.
    Type: Grant
    Filed: September 2, 1993
    Date of Patent: March 28, 1995
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher G. Talbot, Douglas Masnaghetti
  • Patent number: 5357116
    Abstract: Focused ion beam (FIB) systems are used for IC mask or reticle repair and imaging and other applications. The impinging ions can cause an undesirable charge build-up on the specimen. Prior to beginning repair operations in a FIB system, a fluid containing a conductive material such as dimethyl ammonium salt is applied to the reticle, mask or device and allowed to dry, leaving a thin conductive layer on the specimen. A leakage path is preferably provided from the thin conductive layer to ground, to prevent charge buildup on the specimen. The FIB is used to cut through the conductive layer before commencing FIB deposition, to assure proper bonding of the deposited material. The technique also has application with electron beam imaging systems.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: October 18, 1994
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher G. Talbot, Thomas M. Trexler
  • Patent number: 5144225
    Abstract: Methods and apparatus are disclosed for conditional acquisition of potential measurements in integrated circuits, with the aid of electron-beam probes. The conditional acquisition enables display of waveform images which permit diagnosis of the causes and/or origins of failure in circuits which fail intermittently. Data is acquired in the normal manner on each pass through the test pattern. At the end of each test pattern execution a pass/fail signal from the tester exercising the circuit is used to reject or accept the acquired data. In this fashion, it is possible to accumulate only that data which carries information about the failure of interest and to reject data which does not. Over several test pattern repetitions it is possible to display only that data which shows the failure. Engineers are thus able to efficiently diagnose intermittent failures without the need to change device operating parameters.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: September 1, 1992
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher G. Talbot, Neil Richardson
  • Patent number: 5140164
    Abstract: Apparatus is provided which includes a FIB column having a vacuum chamber for receiving an IC, means for applying a FIB to the IC, means for detecting secondary charged particles emitted as the FIB is applied to the IC, and means for electrically stimulating the IC as the FIB is applied to the IC. The apparatus may be used, for example, (1) to locate a conductor buried under dielectric material within the IC, (2) for determining milling end-point when using the FIB to expose a buried conductor of the IC, and (3) to verify the repair of an IC step-by-step as the repair is made.
    Type: Grant
    Filed: January 14, 1991
    Date of Patent: August 18, 1992
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher G. Talbot, Neil Richardson, Douglas Masnaghetti
  • Patent number: 4510384
    Abstract: An optical system is automatically focussed by deriving an electrical signal which has a frequency distribution corresponding to the spatial frequency distribution of an image received from a focussing lens; applying to the electrical signal an amplification which is greater at high frequencies than at low frequencies; and adjusting the optical system to maximize the amplified signal.
    Type: Grant
    Filed: August 16, 1982
    Date of Patent: April 9, 1985
    Assignee: National Research Development Corporation
    Inventors: James B. Grimbleby, Christopher G. Talbot