Abstract: A load control system for controlling the amount of power delivered from an AC power source to a plurality of electrical load includes a plurality of independent units responsive to a broadcast controller. Each independent unit includes at least one commander and at least one energy controller for controlling at least one of the electrical loads in response to a control signal received from the commander. The independent units are configured and operate independent of each other. The broadcast controller transmits wireless signals to the energy controllers of the independent units. The energy controllers do not respond to control signals received from the commanders of other independent units, but the energy controllers of both independent units respond to the wireless signals transmitted by broadcast controller. The energy controller may operate in different operating modes in response to the wireless signals transmitted by the broadcast controller.

Abstract: The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.

Abstract: A process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition wherein the curable resin is a formulation comprising an aromatic glycidyl ether epoxy resin, an inert filler, a quaternary ammonium or phosphonium salt as accelerator, 0.5-1.2 mol per mol epoxy of a saturated cycloaliphatic anhydride and a polycarboxylic acid preferably derived from the reaction of a polyol, this acid being present at a level of 0.05-0.5 mol carboxyl per mol epoxy.

Abstract: The present invention provides a process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition, wherein the curable resin is an epoxy resin formulation comprising an epoxy resin containing more than one epoxide group per molecule on average, an acid anhydride hardener, an accelerator and a filler, the epoxy resin, hardener and accelerator being chosen so that the formulation is stable at 25.degree. C. for at least 14 days.

Abstract: A filled thixotropic resin composition (A) comprises a curable epoxide resin, a filler and, as thickening agent, a condensation product of a sugar alcohol with an aromatic aldehyde, the composition being thickened and made thixotropic such that the filler remains substantially uniformly dispersed therein on storage and such that upon addition of (B) a curing amount of a curing agent comprising a polyamine having at least one primary amine group attached directly to an aliphatic or cycloaliphatic carbon atom or a polycarboxylic acid anhydride, the curing agent substantially counteracts the thixotropic effect of the thickening agent to give a pourable curable composition which is no longer thixotropic and has a viscosity up to about 200 Pa s.

Abstract: Curable compositions comprise:(A) an epoxide resin(B) as latent curing agent for (A), dicyandiamide or a polycarboxylic acid hydrazide, and(C) as cure accelerator dispersed as a powder in the composition, a Mannich base of a polymeric phenol.The compositions are particularly useful as adhesives and sealants.

Abstract: Compositions useful as adhesives, sealants, laminating resins and coatings comprise(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol.Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).

Abstract: Compositions useful as adhesives, sealants, laminating resins and coatings comprise(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol.Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).

Abstract: Adhesion between surfaces of metal, reinforced plastics, glass, friction material or ceramics is effected using an adhesive comprising(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide, isophthalic acid dihydrazide or adipic acid dihydrazide, and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a phenol-aldehyde resin.Typical nitrogen bases used in (c) include benzyldimethylamine, benzimidazole and 2-methylimidazole. Typical phenolic resins are those prepared from phenol and formaldehyde.

Abstract: Compositions useful as adhesives, sealants, laminating resins and coatings comprise(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol.Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).