Abstract: Generally, a robot for transferring a substrate in a processing system is provided. In one embodiment, a robot for transferring a substrate in a processing system includes a body, a linkage and an end effector that is adapted to retain the substrate thereon. The linkage couples the end effector to the body. The end effector and/or the linkage is comprised of a material having a coefficient of thermal expansion less than about 5 m/(m×Kelvin). In another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than about 10 W/m(Kelvin)/(Kelvin). In yet another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than about 10 W/m(Kelvin)/(Kelvin) and a coefficient of fracture toughness less than about 1×106 Pa×m0.5.