Patents by Inventor Christopher Hamaker

Christopher Hamaker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensitized chemically amplified photoresist for use in photomask fabrication and semiconductor processing
    Patent number: 7067227
    Abstract: The disclosure pertains to a photoresist composition and a method of using the photoresist in the fabrication of reticles or features on a semiconductor substrate. The photoresist composition and the method are designed to reduce the variation in critical dimension of features across a surface of a substrate, where the variation in critical dimension is a result of localized resist loading. The photoresist composition is useful when the imaging system is G-line, H-line, or I-line, and the photoresist composition includes a sensitizer which works in combination with a DUV photoresist including a PAC, to sensitize the photoresist to the G-line, H-line and I-line imaging.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: June 27, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Melvin W. Montgomery, Christopher Hamaker
  • Sensitized chemically amplified photoresist for use in photomask fabrication and semiconductor processing
    Publication number: 20030219675
    Abstract: The disclosure pertains to a photoresist composition and a method of using the photoresist in the fabrication of reticles or features on a semiconductor substrate. The photoresist composition and the method are designed to reduce the variation in critical dimension of features across a surface of a substrate, where the variation in critical dimension is a result of localized resist loading. The photoresist composition is useful when the imaging system is G-line, H-line, or I-line, and the photoresist composition includes a sensitizer which works in combination with a DUV photoresist including a PAC, to sensitize the photoresist to the G-line, H-line and I-line imaging.
    Type: Application
    Filed: May 23, 2002
    Publication date: November 27, 2003
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Melvin W. Montgomery, Christopher Hamaker