Patents by Inventor Christopher Hans
Christopher Hans has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978931Abstract: Molten carbonate fuel cell configurations are provided that allow for introduction of an anode input gas flow on a side of the fuel cell that is adjacent to the entry side for the cathode input gas flow while allowing the anode and cathode to operate under co-current flow and/or counter-current flow conditions. It has been discovered that improved flow properties can be achieved within the anode or cathode during co-current flow or counter-current flow operation by diverting the input flow for the anode or cathode into an extended edge seal region (in an extended edge seal chamber) adjacent to the active area of the anode or cathode, and then using a baffle to provide sufficient pressure drop for even flow distribution of the anode input flow across the anode or cathode input flow across the cathode.Type: GrantFiled: February 11, 2021Date of Patent: May 7, 2024Assignee: ExxonMobil Technology and Engineering CompanyInventors: Christopher Howard, Brandon J. O'Neill, Paul J. Rubas, Frank Hershkowitz, Lu Han, Lawrence J. Novacco, Frank J. Dobek, Jr., Keith E. Davis, Brian Bullecks
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Patent number: 11975073Abstract: The present invention provides lymphatic system-directing lipid prodrugs, pharmaceutical compositions thereof, methods of producing such prodrugs and compositions, as well as methods of improving the bioavailability or other properties of a therapeutic agent that comprises part of the lipid prodrug. The present invention also provides methods of treating a disease, disorder, or condition such as those disclosed herein, comprising administering to a patient in need thereof a disclosed lipid prodrug or a pharmaceutical composition thereof.Type: GrantFiled: June 26, 2023Date of Patent: May 7, 2024Assignees: PureTech LYT, Inc., Monash UniversityInventors: Daniel Kenneth Bonner, Rishab R. Shyam, Jamie Simpson, Christopher John Porter, Natalie Trevaskis, Tim Quach, Sifei Han, Luojuan Hu
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Publication number: 20240132218Abstract: Apparatuses, systems, and methods comprising acoustically absorptive air ducts comprising an internally positioned structure component as an endoskeleton and an air impervious inner layer, and an acoustically absorptive foam outer layer, environmental control systems comprising such air ducts, and vehicles incorporating such environmental control systems are disclosed with methods for manufacture and installations are disclosed.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Inventors: Rachel Ann Bires, Douglas Dean Maben, Christopher Edward Plass, Mark Michael Gmerek, David William Olson, Sonny Keever Nguyen, James Julius Koch, Greta Grace Hadford, Bryce Avery Van Dyke, Xin Han
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Publication number: 20240131175Abstract: Provided herein are methods and compositions for site-specific conjugation of antibodies in the presence of a transglutaminase.Type: ApplicationFiled: August 23, 2023Publication date: April 25, 2024Applicant: REGENERON PHARMACEUTICALS, INC.Inventors: Amy HAN, William OLSON, Christopher D'SOUZA
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Publication number: 20240129751Abstract: Apparatuses, systems, and techniques to identify and select a wireless signal beam. In at least one embodiment, a wireless signal beam is identified and selected using a determined angle of arrival of one or more wireless signals at a base station or UE.Type: ApplicationFiled: May 16, 2023Publication date: April 18, 2024Inventors: Mauro Belgiovine, Christopher Hans Dick
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Patent number: 11958910Abstract: Provided herein are bispecific antigen-binding molecules that bind HER2 and methods of use thereof. The bispecific antigen-binding molecules comprise a first and a second antigen-binding domain, wherein the first and second antigen-binding domains bind to two different (preferably non-overlapping) epitopes of the extracellular domain of human HER2. The bispecific antigen-binding molecules cluster on the surface of HER2 IHC2+ and IHC3+ cells, and are internalized into the cellular lysosomes. Also included are antibody-drug conjugates (ADCs) comprising the antibodies or bispecific antigen-binding molecules provided herein linked to a cytotoxic agent, radionuclide, or other moiety, as well as methods of treating cancer in a subject by administering to the subject a bispecific antigen-binding molecule or an ADC thereof.Type: GrantFiled: February 26, 2021Date of Patent: April 16, 2024Assignee: Regeneron Pharmaceuticals, Inc.Inventors: Julian Andreev, Andres Perez Bay, Christopher Daly, Frank Delfino, Amy Han, Thomas Nittoli, William Olson, Gavin Thurston
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Patent number: 11961952Abstract: A secondary battery is provided for cycling between a charged and a discharged state, the secondary battery including a battery enclosure, an electrode assembly, carrier ions, a non-aqueous liquid electrolyte within the battery enclosure, and a set of electrode constraints. The set of electrode constraints includes a primary constraint system having first and second primary growth constraints and at least one primary connecting member, the first and second primary growth constraints separated from each other in the longitudinal direction, wherein the primary constraint array restrains growth of the electrode assembly in the longitudinal direction such that any increase in the Feret diameter of the electrode assembly in the longitudinal direction over 20 consecutive cycles of the secondary battery is less than 20%.Type: GrantFiled: September 6, 2022Date of Patent: April 16, 2024Assignee: Enovix CorporationInventors: Robert S. Busacca, Ashok Lahiri, Murali Ramasubramanian, Bruno A. Valdes, Gardner Cameron Dales, Christopher J. Spindt, Geoffrey Matthew Ho, Harrold J. Rust, III, James D. Wilcox, John F. Varni, Kim Han Lee, Nirav S. Shah, Richard J. Contreras, Lynn Van Erden, Vladimir Dioumaev
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Publication number: 20240119383Abstract: An orchestration system of or otherwise available to a web platform centralizes the execution of workflow components of a workflow associated with a job posting hosted by the web platform using various software services internal and/or external to the web platform. The workflow components and attributes thereof are determined based on the job posting. Domain-specific language (DSL) instructions for the various workflow components are generated. First DSL instructions are invoked by the orchestration system to cause an execution of a first workflow component of the workflow by a first software service. The orchestration system obtains an output of the first workflow component, such as values of relevant attributes, and, based on the output and in some cases information derived other than from the first workflow component, invokes next DSL instructions to cause an execution of a next workflow component of the workflow by another software service.Type: ApplicationFiled: October 10, 2022Publication date: April 11, 2024Inventors: John Bowers, Xiqian Han, Quanzheng Long, Jacob Lucas, Russel Mommaerts, Jeremy Spencer, Hemant Tanwar, David Thrift, Adam Ullrich, Christopher Valencia
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Publication number: 20240114693Abstract: In one embodiment, an apparatus includes a first metal layer, a second metal layer above the first metal layer, a first metal via generally perpendicular with and connected to the first metal layer, a second metal via generally perpendicular with and connected to the second metal layer, a third metal via generally perpendicular with and extending through the first metal layer and the second metal layer, a ferroelectric material between the third metal via and the first metal layer and between the third metal via and the second metal layer, and a hard mask material around a portion of the first metal via above the first metal layer and the second metal layer, around a portion of the second metal via above the first metal layer and the second metal layer, and around a portion of the ferroelectric material above the first metal layer and the second metal layer.Type: ApplicationFiled: September 30, 2022Publication date: April 4, 2024Applicant: Intel CorporationInventors: Christopher M. Neumann, Brian Doyle, Nazila Haratipour, Shriram Shivaraman, Sou-Chi Chang, Uygar E. Avci, Eungnak Han, Manish Chandhok, Nafees Aminul Kabir, Gurpreet Singh
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Patent number: 11938137Abstract: The present invention provides lymphatic system-directing lipid prodrugs, pharmaceutical compositions thereof, methods of producing such prodrugs and compositions, and methods of improving the bioavailability or other properties of a therapeutic agent that comprises part of the lipid prodrug. The present invention also provides methods of treating a disease, disorder, or condition such as those disclosed herein, comprising administering to a patient in need thereof a disclosed lipid prodrug or a pharmaceutical composition thereof.Type: GrantFiled: January 27, 2022Date of Patent: March 26, 2024Assignees: PureTech LYT, Inc., Monash UniversityInventors: Daniel Kenneth Bonner, Ketki Karanam, Sifei Han, Luojuan Hu, Christopher John Hamilton Porter, Tim Quach, Rishab R. Shyam, Jamie Simpson, Natalie Trevaskis
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Publication number: 20240095536Abstract: Apparatuses, systems, and techniques to cause one or more neural networks to be trained. In at least one embodiment, a processor includes one or more circuits to cause one or more neural networks to be trained based, at least in part, on one or more capabilities.Type: ApplicationFiled: May 5, 2022Publication date: March 21, 2024Inventors: Xingqin Lin, Lopamudra Kundu, Christopher Hans Dick
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Publication number: 20230359872Abstract: Apparatuses, systems, and techniques to indicate capabilities of a neural network. In at least one embodiment, a processor includes one or more circuits to indicate one or more capabilities of a neural network.Type: ApplicationFiled: May 5, 2022Publication date: November 9, 2023Inventors: Xingqin Lin, Lopamudra Kundu, Christopher Hans Dick
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Publication number: 20230258678Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a fluidic die to advance across an ejection path relative to a substrate. The fluidic die includes a channel to contain a portion of a sample fluid, a sensor to detect passage of a particle within the sample fluid into the channel, and an ejection device. The ejection device is to eject the particle. The system also includes a controller. The controller identifies discrete locations along the ejection path as waste sites as the fluidic die advances along the ejection path. This is done by 1) classifying the particle as a target particle or a non-target particle, 2) upon identification of a target particle, ejecting the target particle to a target site of the substrate, and 3) upon identification of a non-target particle, ejecting the non-target particle to a waste site.Type: ApplicationFiled: February 11, 2022Publication date: August 17, 2023Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Joshua M. Yu, Angela Bakkom, Christopher Hans Bakker
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Patent number: 11407229Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and a logic circuit having a communication address to communicate with the print apparatus logic circuit. The logic circuit is configured to detect, via the interface, communications that include an other communication address. The logic circuit is configured to respond, via the interface, to a command series directed to the logic circuit that include the communication address of the logic circuit, based on the detected communications.Type: GrantFiled: October 25, 2019Date of Patent: August 9, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stephen D. Panshin, Jefferson P. Ward, James Michael Gardner, Anthony D. Studer, David N. Olsen, Quinton B. Weaver, David Owen Roethig, Christopher Hans Bakker, David B. Novak
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Patent number: 11351791Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The logic circuit is configured to receive, via the interface, a plurality of first requests in a heater disabled mode, each first request corresponding to a different sensor ID of a plurality of sensor IDs; transmit, via the interface, a first digital value in response to each first request; receive, via the interface, a plurality of second requests in a heater enabled mode, each second request corresponding to a different sensor ID of the plurality of sensor IDs; and transmit, via the interface, a second digital value in response to each second request. Delta values corresponding to a difference between the first digital value and the second digital value for each different sensor ID of the plurality of sensor IDs are indicative of a print material level.Type: GrantFiled: December 3, 2019Date of Patent: June 7, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: James Michael Gardner, James William Ring, David Owen Roethig, Christopher Hans Bakker
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Patent number: 11338586Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.Type: GrantFiled: December 3, 2019Date of Patent: May 24, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Anthony D. Studer, Quinton B. Weaver, David N. Olsen, James Michael Gardner, James William Ring, David Owen Roethig, Christopher Hans Bakker
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Publication number: 20220001673Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir having a first print material level, and a logic circuitry package including an interface and a logic circuit. The logic circuit may receive, via the interface, a first calibration parameter and receive, via the interface, a first request corresponding to a first sensor ID associated with a second print material level above the first print material level. The logic circuit may transmit, via the interface, a first digital value in response to the first request and receive, via the interface, a second calibration parameter less than the first calibration parameter. The logic circuit may receive, via the interface, a second request corresponding to the first sensor ID, and transmit, via the interface, a second digital value in response to the second request. The second digital value is less than the first digital value.Type: ApplicationFiled: October 25, 2019Publication date: January 6, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Daryl Eugene ANDERSON, James Michael GARDNER, Christopher Hans BAKKER
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Publication number: 20210402784Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and a logic circuit having a communication address to communicate with the print apparatus logic circuit. The logic circuit is configured to detect, via the interface, communications that include an other communication address. The logic circuit is configured to respond, via the interface, to a command series directed to the logic circuit that include the communication address of the logic circuit, based on the detected communications.Type: ApplicationFiled: October 25, 2019Publication date: December 30, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Stephen D. PANSHIN, Jefferson P. WARD, James Michael GARDNER, Anthony D. STUDER, David N. OLSEN, Quinton B. WEAVER, David Owen ROETHIG, Christopher Hans BAKKER, David B. NOVAK
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Publication number: 20210402783Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.Type: ApplicationFiled: December 3, 2019Publication date: December 30, 2021Inventors: Anthony D. STUDER, Quinton B. WEAVER, David N. N. OLSEN, James Michael GARDNER, Jim RING, David Owen ROETHIG, Christopher Hans BAKKER
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Patent number: D976270Type: GrantFiled: March 5, 2021Date of Patent: January 24, 2023Assignee: Maplebear Inc.Inventors: Christopher Hans Nietes Rudnick, Min Ho Kim, Matthew Ryan Marcuccio, Aref Kashani Nejad, John Alexander Wilde, Laimonas Turauskas, Brian Patrick Mahlstedt, Imaan Munir