Patents by Inventor Christopher Hardiman

Christopher Hardiman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230029763
    Abstract: A semiconductor die includes a semiconductor body having a gate, a source contact, and a drain contact thereon, a metal contact structure on the semiconductor body and electrically connected to the gate, the source contact, or the drain contact, and an encapsulation structure. The encapsulation structure includes first and second encapsulation layers of respective non-conductive materials stacked on the metal contact structure, and an opening extending therethrough to expose the metal contact structure. The opening includes a sidewall having a substantially continuous slope that extends through the first and second encapsulation layers to the metal contact structure. Related devices and fabrication methods are also discussed.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Inventors: Christopher Hardiman, Daniel Namishia, Kyle Bothe, Elizabeth Keenan, David Santa Ana, Daniel Etter