Abstract: The invention relates to a method of cleaning the surface of a substrate to remove post-etch residue or post chemical mechanical polishing residues from the surface of a substrate. Specifically, the present invention relates to a method of post-CMP or post-etch cleaning. The method involves contacting the surface of a substrate with a CMP composition or an etching composition, that contains free radicals, and subsequently contacting the surface of the substrate with a composition that comprises a free radical quencher.

Abstract: The use of mixed cerium-containing synthetic solid abrasive materials in chemical mechanical polishing slurries can provide better selectivity, better substrate removal rates, or lower defect rates than conventional ceria slurries. The slurries have abrasive particles that include a plurality of solid cerium-containing phases selected from CeO2, Ce2O3, cerium-nitride material, cerium-fluoride material, and cerium-sulfide material, where different cerium-containing materials are present in different particles or on the same particles.

Abstract: A method of preserving wood includes injecting into the wood an effective amount of a aqueous wood-injectable biocidal slurry, said a wood-injectable biocidal slurry containing dispersants and sub-micron biocidal particles selected from at least one of the following classes: 1) a plurality of particles containing at least 25% by weight of a solid phase of sparingly soluble salts selected from copper salts, nickel salts, tin salts, and/or zinc salts; 2) a plurality of particles containing at least 25% by weight of a solid phase of sparingly soluble metal hydroxides selected from copper hydroxide, nickel hydroxide, tin hydroxide, and/or zinc hydroxide; 3) a plurality of particles containing at least 25% by weight of a solid phase comprising a substantially-insoluble organic biocide selected from triazoles, chlorothalonil, iodo-propynyl butyl carbamate, copper-8-quinolate, fipronil, imidacloprid, bifenthrin, carbaryl, strobulurins, and indoxacarb; 4) a plurality of particles containing on the outer surface there

Abstract: The invention generally relates to compositions and methods for chemically mechanically polishing a substrate, including a polishing accelerator, which is normally one or more oxidizers, an abrasive material, and chelating particles and/or metal-absorbent clay material. In addition, the invention can also involve methods of forming chelator particles and methods of separating metal-containing ions from polishing and/or etching solutions after polishing and/or etching.