Patents by Inventor Christopher Herrick

Christopher Herrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086905
    Abstract: Disclosed is a computing system and method for protecting access to a particular resource. The computing device can identify a first cryptographic token in a first digital wallet. The first cryptographic token is configured to provide access to a particular resource. The computing device can generate a second cryptographic token bound to the first cryptographic token. The computing device can transfer the second cryptographic token to a second digital wallet based on the first cryptographic token. The computing device can access the particular resource based on the second cryptographic token being in the second digital wallet.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 14, 2024
    Inventors: Christopher Esquibel, Emily Herrick
  • Patent number: 7457132
    Abstract: Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub sections can distort signals passing through the interconnect and decrease the usable bandwidth of the interconnect. To minimize distortion and increase bandwidth, one or more terminating elements can be attached to the unterminated end of the via-stub section. The impedance terminating element may include, by way of non-limiting example, one or more resistors, capacitors, and/or inductors between the via stub and a ground layer. The impedance terminating element may be formed internally to the PCB or mounted to the PCB surface.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: November 25, 2008
    Assignee: Sanmina-SCI Corporation
    Inventors: Franz Gisin, Christopher Herrick
  • Publication number: 20070091581
    Abstract: Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub sections can distort signals passing through the interconnect and decrease the usable bandwidth of the interconnect. To minimize distortion and increase bandwidth, one or more terminating elements can be attached to the unterminated end of the via-stub section. The impedance terminating element may include, by way of non-limiting example, one or more resistors, capacitors, and/or inductors between the via stub and a ground layer. The impedance terminating element may be formed internally to the PCB or mounted to the PCB surface.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 26, 2007
    Inventors: Franz Gisin, Christopher Herrick