Abstract: Methods and systems for the destruction of one or more PFCs in a gas stream are provided. The gas stream can come from semiconductor processing, for example. The PFCs in the gas stream are reacted with steam in the presence of a catalyst to fragment the PFCs into other compounds that are readily removed from the gas stream. The catalyst comprises gallium, and can additionally comprise zirconium oxide. The gas stream can also be pre-treated prior to reacting the PFCs with steam to remove substances that could be deleterious to the catalyst.

Abstract: A connector assembly configured to sealably engage with a mating connector. The connector assembly includes a plug assembly that has a mating end configured to be inserted into the cavity of the mating connector. The connector assembly also includes a collar that surrounds the plug assembly. The connector assembly also includes a sleeve member that is positioned between the collar and the plug assembly. The sleeve member surrounds the plug assembly about the central axis and includes a plurality of fingers that extend toward the mating end. The sleeve member is stamped and formed from a common piece of sheet material. The fingers are biased away from the central axis in a flared arrangement when the collar is in the withdrawn position. The lingers press against the wall surface of the mating connector when the collar is moved from the withdrawn position to the locked position.

Abstract: Methods and systems for the destruction of one or more PFCs in a gas stream are provided. The gas stream can come from semiconductor processing, for example. The PFCs in the gas stream are reacted with steam in the presence of a catalyst to fragment the PFCs into other compounds that are readily removed from the gas stream. The catalyst comprises gallium, and can additionally comprise zirconium oxide. The gas stream can also be pre-treated prior to reacting the PFCs with steam to remove substances that could be deleterious to the catalyst.

Abstract: A system for abating dangerous substances, for example, from a semiconductor fabrication process tool, comprises a thermal oxidation unit configured to accept a waste gas stream, a particulate remover directly coupled to the thermal oxidation unit, a universal sump chassis directly coupled to the particulate remover, a packed column directly coupled to the universal sump chassis, and a dry scrub canister coupled to the packed column. An embodiment includes multiple parallel components, that is, two or more thermal oxidation units, each configured to accept a different waste gas stream which may be combustible when mixed, two or more particulate removers and two or more packed columns, each directly coupled to the universal sump chassis. A method comprises, first, oxidizing combustible substances; second, removing particulate-phase and water-soluble gas-phase components; third, absorbing acid gases; and last, adsorbing residual contaminants.

Abstract: A system for controlling emissions of hazardous, toxic or otherwise undesirable components in a waste gas stream, while maintaining uptime through decreased maintenance and repair, is provided. The system oxidizes the waste gas stream at high temperatures with a thermal oxidizer (110), effectively removes particulates in the waste gas stream as well as moderate levels of acid gas through a cyclone scrubber (120), and removes the remainder of the acid gas content in the waste gas stream through he use of a packed column (130). Finally, a condenser (140) lowers the moisture content of the waste gas stream before leaving the system by way of a blower (150), reducing the chance of condensation and corrosion in the facility ductwork. As a result, the system can run for sustained periods of time, reducing downtime in semiconductor operations and associated loss of revenue.