Patents by Inventor Christopher J. Bahr

Christopher J. Bahr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System, apparatus, and method for advanced solder bumping
    Patent number: 7790598
    Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: September 7, 2010
    Assignee: Intel Corporation
    Inventors: Mengzhi Pang, Christopher J. Bahr, Ravindra Tanikella, Charan Gurumurthy
  • SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING
    Publication number: 20090196000
    Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.
    Type: Application
    Filed: February 27, 2009
    Publication date: August 6, 2009
    Inventors: Mengzhi Pang, Christopher J. Bahr, Ravindra Tanikella, Charan Gurumurthy
  • System, apparatus, and method for advanced solder bumping
    Patent number: 7517788
    Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: April 14, 2009
    Assignee: Intel Corporation
    Inventors: Mengzhi Pang, Christopher J. Bahr, Ravindra Tanikella, Charan Gurumurthy