Patents by Inventor Christopher J. Majka

Christopher J. Majka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7108809
    Abstract: An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: September 19, 2006
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, Christopher J. Majka, John H. Sherman
  • Patent number: 6982387
    Abstract: A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: January 3, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Publication number: 20040061248
    Abstract: An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.
    Type: Application
    Filed: October 1, 2002
    Publication date: April 1, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, Christopher J. Majka, John H. Sherman
  • Patent number: 6712261
    Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 30, 2004
    Assignee: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Patent number: 6651013
    Abstract: A method and apparatus for locating a short between two nets in an electrical wire network of a microelectronic structure (e.g., chip, chip carrier, circuit card, etc.). A first net and a second net of the electrical wire are electrically shorted at an unknown point PS on the first net. Points PA and PB on the first net such are selected such that PS is located on a path between PA and PB along the first net. A constant current pulse source is electrically connected between PA and PB and is activated. Voltage drops VAB (from PA to PB) and VAC (from PA to a point PC on the second net) are measured. A length LAS of the path from PA to PS is calculated as a function of VAC/VAB. Computer graphics may be used to graphically display the location of the short within the microelectronic structure.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: November 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: How T. Lin, Christopher J. Majka, Matthew Francis Seward
  • Publication number: 20030178471
    Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
    Type: Application
    Filed: March 20, 2002
    Publication date: September 25, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Publication number: 20020189861
    Abstract: The present invention provides an interconnect between layers of a circuit board. A conductive object is embedded in the layer of a circuit board.
    Type: Application
    Filed: June 19, 2001
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Patent number: 6369592
    Abstract: A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: April 9, 2002
    Assignee: International Business Machines Corporation
    Inventors: Christopher J. Majka, Matthew Seward
  • Patent number: 6198529
    Abstract: An automated inspection system particularly adapted for detection and discrimination of surface irregularities of specularly reflecting and other materials, such as are employed in laminate chip carriers and printed circuit boards, includes an area scan image sensor allowing illumination sources to surround an area of a surface being inspected. The illumination source preferably provides either or both bright field and dark field illumination of the surface; developing generally complementary images of surface irregularities. A self-registering rules-driven process for developing inspection masks reduces alignment operations and improves performance. Image enhancement and morphological operations to detect surface irregularities are performed by digital signal processing, preferably using a dedicated vision processor. Masks screen potential defects to critical mounting and bonding surfaces accurately without requiring alignment of data or reference images to acquired images.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: John C. Clark, Jr., Earle W. Gillis, Christopher J. Majka, Matthew F. Seward, Michael M. Westgate
  • Patent number: 6005394
    Abstract: The accuracy of a capacitive testing procedure is improved by adjusting the ideal values against which comparisons are made during the testing process, for all of the circuit elements (e.g., pin connections) being tested, responsive to cumulative deviations of the measured values from their anticipated ideal values. This can be accomplished by initially comparing all of the capacitance measurements taken for a given printed circuit to their ideal values, and calculating a deviation for each of the comparisons made. Following the testing of an entire printed circuit, the resulting series of calculated deviations are tabulated and averaged, and the resulting average deviation is then added to or subtracted from the tabulated readings for each of the circuit elements before any true defects are identified for the printed circuit being tested. In this way, all of the parts being tested are brought to the same baseline, eliminating overall reference differences (i.e., between different panels).
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: December 21, 1999
    Assignee: International Business Machines Corporation
    Inventors: Christopher J. Majka, Matthew F. Seward
  • Patent number: 4644237
    Abstract: A collision avoidance system for a two arm robot is direction sensitive. When the separation between the arms is sensed as equal to or smaller than a predetermined distance, the trailing arm is slowed to avoid a collision. The separation sensor generates a first "slow" signal when the separation is a first predetermined distance, a second "slow" signal when the separation is a second predetermined distance, smaller than the first, and a "stop" signal when the separation is a third predetermined distance, smaller than the second. The polarity of the drive signals for the arms determine their direction, and polarity sensitive comparators determine the direction of each arm. When the first "slow" signal is present and one arm is moving in the direction of the other arm, a speed reducing resistor is inserted in the circuit for the drive signal for the one arm to reduce its speed.
    Type: Grant
    Filed: October 17, 1985
    Date of Patent: February 17, 1987
    Assignee: International Business Machines Corp.
    Inventors: James E. Frushour, Michael L. Mahar, Christopher J. Majka, John E. Swenson