Patents by Inventor Christopher J. Zins
Christopher J. Zins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230303430Abstract: According to various embodiments, a composition for preparing glass fibers comprises from about 58 wt. % to about 69 wt. % SiO2, from about 8 wt. % to about 15 wt. % RO, wherein RO is a total amount of MgO and CaO, from about 12 wt. % to about 18 wt. % R2O, wherein R2O is a total amount of Na2O and K2O, up to about 2 wt. % of a single oxidizing agent, and Fe2O3 and FeO. A ratio of Fe2+/Fe3+ is between 0.02 and 0.1. The glass composition has a log 3 viscosity of between about 911 ° C. and about 1173 ° C.Type: ApplicationFiled: March 20, 2023Publication date: September 28, 2023Inventors: Bruno A. Purnode, Scott E. Colangelo, Christopher J. Bloom, Christopher J. Zins, Steven J. Mighton
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Patent number: 11549635Abstract: A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.Type: GrantFiled: June 26, 2017Date of Patent: January 10, 2023Assignee: Intelligent Energy LimitedInventors: Steven J. Eickhoff, Jeffrey Michael Klein, Christopher J. Zins
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Publication number: 20180003334Abstract: A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.Type: ApplicationFiled: June 26, 2017Publication date: January 4, 2018Inventors: Steven J. Eickhoff, Jeffrey Michael Klein, Christopher J. Zins
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Patent number: 8034296Abstract: A microfluidic circuit cartridge for a complete blood count, including analyses of red blood cells. Various parameters of the red blood cells may be attained. The cartridge may have sphering mechanism which has a channel or loop with a configuration for reducing or eliminating cell settling. The channel or loop may incorporate a combination of straight and curve paths in the context of gravity. The channel may alternatively have a hydrophilic or hydrophobic inside surface. Again alternatively, the channel may have an electro-wettable inside surface. Or, the channel may be subject to an electric or magnetic field. There may also be a mechanism for reducing or eliminating clumping of a sample.Type: GrantFiled: June 30, 2006Date of Patent: October 11, 2011Assignee: Honeywell International Inc.Inventors: James A. Cox, Aravind Padmanabhan, Ron L. Bardell, Christopher J. Zins
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Patent number: 7688427Abstract: A system for determining particle parameters. The system may, for example, may optically determine parameters common to a hematology analysis. Such parameters may include a red blood cell count, a platelet count, a mean cell volume and a red cell distribution width. A hematocrit parameter may be calculated. Also, a measurement of hemoglobin in a blood sample may be obtained leading to a calculation of a mean mass of hemoglobin in a red blood cell and a mean cell hemoglobin concentration. The system may be implemented in a portable cartridge type cytometer.Type: GrantFiled: April 28, 2006Date of Patent: March 30, 2010Assignee: Honeywell International Inc.Inventors: James A. Cox, Christopher J. Zins
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Patent number: 7630835Abstract: A first frequency of electromagnetic radiation and a second frequency of electromagnetic radiation are received at a detector. The first and second frequencies of electromagnetic radiation are transmitted through a medium within a frequency range of approximately 0.1 TeraHertz to approximately 10 TeraHertz. Signals are generated that are proportional to the transmittance of the frequencies of electromagnetic radiation through the medium. A ratio of the of the signals is formed, and one or more of a relative humidity, an absolute humidity, and a water vapor concentration of the medium are calculated as a function of a temperature of the medium, the ratio, and a set of functional parameters associated with the temperature of the medium.Type: GrantFiled: October 31, 2007Date of Patent: December 8, 2009Assignee: Honeywell International Inc.Inventors: James A. Cox, Christopher J. Zins
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Publication number: 20090107214Abstract: A first frequency of electromagnetic radiation and a second frequency of electromagnetic radiation are received at a detector. The first and second frequencies of electromagnetic radiation are transmitted through a medium within a frequency range of approximately 0.1 TeraHertz to approximately 10 TeraHertz. Signals are generated that are proportional to the transmittance of the frequencies of electromagnetic radiation through the medium. A ratio of the of the signals is formed, and one or more of a relative humidity, an absolute humidity, and a water vapor concentration of the medium are calculated as a function of a temperature of the medium, the ratio, and a set of functional parameters associated with the temperature of the medium.Type: ApplicationFiled: October 31, 2007Publication date: April 30, 2009Inventors: James A. Cox, Christopher J. Zins
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Patent number: 7470894Abstract: A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.Type: GrantFiled: May 15, 2006Date of Patent: December 30, 2008Assignee: Honeywell International Inc.Inventors: Barrett E. Cole, Robert E. Higashi, Christopher J. Zins, Subash Krishnankutty
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Patent number: 7071566Abstract: A spectrally tunable optical detector and methods of manufacture therefore are provided. In one illustrative embodiment, the tunable optical detector includes a tunable bandpass filter, a detector and readout electronics, each supported by a different substrate. The substrates are secured relative to one another to form the spectrally tunable optical detector.Type: GrantFiled: May 23, 2002Date of Patent: July 4, 2006Assignee: Honeywell International Inc.Inventors: Barrett E. Cole, Robert E. Higashi, Christopher J. Zins, Subash Krishnankutty
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Publication number: 20030173499Abstract: A spectrally tunable optical detector and methods of manufacture therefore are provided. In one illustrative embodiment, the tunable optical detector includes a tunable bandpass filter, a detector and readout electronics, each supported by a different substrate. The substrates are secured relative to one another to form the spectrally tunable optical detector.Type: ApplicationFiled: May 23, 2002Publication date: September 18, 2003Applicant: Honeywell International Inc.Inventors: Barrett E. Cole, Robert E. Higashi, Christopher J. Zins, Subash Krishnankutty
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Patent number: 6495070Abstract: A microbolometer film material VOx having a value such that the thermal coefficient of resistance is between 0.005 and 0.05. The film material may be formed on a wafer. The VOx material properties can be changed or modified by controlling certain parameters in the ion beat sputter deposition environment. There is sufficient control of the oxidation process to permit non-stoichometric formation of VOx films. The process is a low temperature process (less than 100 degrees C.). Argon is used for sputtering a target of vanadium in an environment wherein the oxygen level is controlled to determine the x of VOx. The thickness of the film is controlled by the time of the deposition. Other layers may be deposited as needed to form pixels for a bolometer array.Type: GrantFiled: December 30, 1998Date of Patent: December 17, 2002Assignee: Honeywell International Inc.Inventors: Barrett E. Cole, Christopher J. Zins
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Patent number: 6322670Abstract: A microbolometer film material VOx having a value such that the thermal coefficient of resistance is between 0.005 and 0.05. The film material may be formed on a wafer. The VOx material properties can be changed or modified by controlling certain parameters in the ion beam sputter deposition environment. There is sufficient control of the oxidation process to permit non-stoichometric formation of VOx films. The process is a low temperature process (less than 100 degrees C.). Argon is used for sputtering a target of vanadium in an environment wherein the oxygen level is controlled to determine the x of VOx. The thickness of the film is controlled by the time of the deposition. Other layers may be deposited as needed to form pixels for a bolometer array.Type: GrantFiled: December 31, 1996Date of Patent: November 27, 2001Assignee: Honeywell International Inc.Inventors: Barrett E. Cole, Christopher J. Zins
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Patent number: 6313463Abstract: A high performance microbolometer in which a pixel contains the material VOx wherein x of VOx is set at a value to adjust a thermal coefficient of resistance to a selected value between 0.005 and 0.05.Type: GrantFiled: December 30, 1998Date of Patent: November 6, 2001Assignee: Honeywell International Inc.Inventors: Barrett E. Cole, Christopher J. Zins
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Publication number: 20010035341Abstract: A microbolometer film material VOx having a value such that the thermal coefficient of resistance is between 0.005 and 0.05. The film material may be formed on a wafer. The VOx material properties can be changed or modified by controlling certain parameters in the ion beam sputter deposition environment. There is sufficient control of the oxidation process to permit non-stoichometric formation of VOx films. The process is a low temperature process (less than 100 degrees C.). Argon is used for sputtering a target of vanadium in an environment wherein the oxygen level is controlled to determine the x of VOx. The thickness of the film is controlled by the time of the deposition. Other layers may be deposited as needed to form pixels for a bolometer array.Type: ApplicationFiled: December 31, 1996Publication date: November 1, 2001Inventors: BARRETT E. COLE, CHRISTOPHER J. ZINS